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XX1000

Features: Excellent Broadband Mixer DriverSingle Ended Fed Doubler with Distributed Buffer AmplifierExcellent LO Driver for Mimix Receivers+15 dBm Output Drive100% On-Wafer RF, DC and Output Power Testing100% Visual Inspection to MIL-STD-883Method 2010Specifications Drain Bias Voltage (Vd) +...

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XX1000: Features: Excellent Broadband Mixer DriverSingle Ended Fed Doubler with Distributed Buffer AmplifierExcellent LO Driver for Mimix Receivers+15 dBm Output Drive100% On-Wafer RF, DC and Output Power T...

XX1000 Data Sheet

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Part Number:
XX1000
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/24

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Product Details

Description



Features:

Excellent Broadband Mixer Driver
Single Ended Fed Doubler with Distributed Buffer Amplifier
Excellent LO Driver for Mimix Receivers
+15 dBm Output Drive
100% On-Wafer RF, DC and Output Power Testing
100% Visual Inspection to MIL-STD-883
Method 2010


Specifications

Drain Bias Voltage (Vd) +6.0 Vdc
Supply Voltage (Vss) -6.0 Vdc
Supply Current (Id) 300 mA
Supply Current (Iss) 60 mA
Gate Bias Voltage (Vg) +0.3 Vdc
Input Power (RF Pin) 12.0 dBm
Storage Temperature (Tstg) -65 to +165
Operating Temperature (Ta) -55 to MTTF Table1
Channel Temperature (Tch) MTTF Table1


(1) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.




Description

Mimix Broadband's single ended fed (no external balun required) 7.5-25.0/15.0-50.0 GHz GaAs MMIC doubler has a +15.0 dBm output drive and is an excellent LO doubler that can be used to drive fundamental mixer devices. It is also well suited to drive Mimix's XR1002 receiver device. This MMIC uses Mimix Broadband's 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This XR1002 device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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