IRKV56

The Generation V of Add-A-pak module IRKV56 combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

The Cu baseplate IRKV56 allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.

The Generation V of AAP module IRKV56 is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.