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KBPC1010GS

Features: · Glass Passivated Die Construction· Low Forward Voltage Drop· High Current Capability · High Reliability· High Surge Current Capability· Ideal for Printed Circuit Boards· Designed for Saving Mounting SpaceSpecifications Characteristic Symbol KBPC 1000GS KBPC 1001GS ...

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SeekIC No. : 004384444 Detail

KBPC1010GS: Features: · Glass Passivated Die Construction· Low Forward Voltage Drop· High Current Capability · High Reliability· High Surge Current Capability· Ideal for Printed Circuit Boards· Designed for Sav...

KBPC1010GS Data Sheet

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Part Number:
KBPC1010GS
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/30

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Product Details

Description



Features:

· Glass Passivated Die Construction
· Low Forward Voltage Drop
· High Current Capability
· High Reliability
· High Surge Current Capability
· Ideal for Printed Circuit Boards
· Designed for Saving Mounting Space


Specifications

Characteristic Symbol KBPC
1000GS		 KBPC
1001GS		 KBPC
1002GS		 KBPC
1004GS		 KBPC
1006GS		 KBPC
1008GS		 KBPC
1010GS		 Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage		 VRRM
VRWM
VR		 50 100 200 400 600 800 1000 V
RMS Reverse Voltage VR(RMS) 35 70 140 280 420 560 700 V
Average Rectified Output Current @TA = 50°C IO 10 A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)		 IFSM 200 A
Forward Voltage (per element) @IF = 5.0A VFM 1.1 V
Peak Reverse Current @TA = 25°C
At Rated DC Blocking Voltage @TA = 125°C		 IR 5.0
500		 A
mA
Rating for Fusing (t < 8.3ms) (Note 1) I2t 374 A2s
Typical Thermal Resistance (Note 2) RJC 2.0 K/W
RMS Isolation Voltage from Case to Lead VISO 2500 V
Operating and Storage Temperature Range Tj, TSTG -65 to +150 °C
Note: 1. Non-repetitive for t > 1ms and < 8.3ms.
2. Thermal resistance junction to case per element mounted on 8" x 8" x 25" thick AL plate.


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