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KBU810G

Features: ·Glass Passivated Die Construction ·Low Forward Voltage Drop ·High Current Capability ·High Reliability·High Surge Current Capability ·Ideal for Printed Circuit Boards ·Recognized File # E157705Specifications Characteristics Symbol KBU800G KBU801G KBU802G KBU804G KBU806G KBU8...

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SeekIC No. : 004384746 Detail

KBU810G: Features: ·Glass Passivated Die Construction ·Low Forward Voltage Drop ·High Current Capability ·High Reliability·High Surge Current Capability ·Ideal for Printed Circuit Boards ·Recognized File # E...

KBU810G Data Sheet

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Part Number:
KBU810G
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

·Glass Passivated Die Construction
·Low Forward Voltage Drop
·High Current Capability
·High Reliability
·High Surge Current Capability
·Ideal for Printed Circuit Boards
·Recognized File # E157705


Specifications

Characteristics Symbol KBU
800G		 KBU
801G		 KBU
802G		 KBU
804G		 KBU
806G		 KBU
808G		 KBU
810G		 UNIT
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage		 VRRM
VRWM
VR		 50 100 200 400 600 800 1000 V
RMS Reverse Voltage VR(RMS) 35 70 140 280 480 560 700 V
Average Rectified Output Current @TC = 100°C
(Note 1)		 Io 8.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)		 IFSM 300 A
Forward Voltage per leg @IF = 4.0A VFM 1.0 V
Peak Reverse Current @TA = 25°C
At Rated DC Blocking Voltage @TA = 125°C		 IR 10
1.0		 A
mA
Typical Thermal Resistance per leg (Note 2) RJA 18 °C/W
Typical Thermal Resistance per leg (Note 1) RJC 3.0 °C/W
Operating Temperature Range Tj -65 to +150
Storage Temperature Range TSTG -65 to +150
Note: 1. Mounted on 75 x 75 x 3.0mm Al. plate.
2. Mounted on PCB at 9.5mm lead length with 12mm2 copper pad.


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