AD7839, AD7839AS-, AD7839AS. Selling Leads, Datasheet
MFG:ADI Package Cooled:N/A D/C:09+
AD7839, AD7839AS-, AD7839AS. Datasheet download

Part Number: AD7839
MFG: ADI
Package Cooled: N/A
D/C: 09+
MFG:ADI Package Cooled:N/A D/C:09+
AD7839, AD7839AS-, AD7839AS. Datasheet download

MFG: ADI
Package Cooled: N/A
D/C: 09+
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Datasheet: AD7839
File Size: 169264 KB
Manufacturer:
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PDF/DataSheet Download
Datasheet: AD7001
File Size: 634418 KB
Manufacturer: AD [Analog Devices]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: AD7001
File Size: 634418 KB
Manufacturer: AD [Analog Devices]
Download : Click here to Download
The AD7839 contains eight 13-bit DACs on one monolithic chip. It has output voltages with a full-scale range of ±10 V from reference voltages of ±5 V.
The AD7839 accepts 13-bit parallel loaded data from the external bus into one of the input registers under the control of the WR, CS and DAC channel address pins, A0A2.
The DAC outputs are updated on reception of new data into the DAC registers. All the outputs may be updated simultaneously by taking the LDAC input low.
Each DAC output is buffered with a gain-of-two amplifier into which an external DAC offset voltage can be inserted via the DUTGNDx pins.
The AD7839 is available in a 44-lead MQFP package.
VCC to GND3 . . . . . . . . . . . . . . .0.3 V, +7 V or VDD + 0.3 V
(Whichever Is Lower)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V, +17 V
VSS to GND . . . . . . . . . . . . . . . . . . . .. . . . . . . +0.3 V, 17 V
Digital Inputs to GND . . . . . . . . . . . . . . 0.3 V, VCC + 0.3 V
VREF(+) to VREF() . . . . . . . . . . . . . . . . . . . . 0.3 V, +18 V
VREF(+) to GND . . . . . . . . . . . . . . . VSS 0.3 V, VDD + 0.3 V
VREF() to GND . . . . . . . . . . . . . . VSS 0.3 V, VDD + 0.3 V
DUTGND to GND . . . . . . . . . . .... . . VSS 0.3 V, VDD + 0.3 V
VOUT (AH) to GND . . . . . . . . .. . . VSS 0.3 V, VDD + 0.3 V
Operating Temperature Range
Industrial (A Version) . . . . . . . . . .. . . 40°C to +85°C
Storage Temperature Range . . . . . . . . . 65°C to +150°C
Junction Temperature (TJ max) . . . . . . .. . . . . . . . . .+150°C
MQFP Package
Power Dissipation . . . . . . . . . . . . . . . . (TJ max TA)/JA
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . 95°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >4000 V

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