BA6566F-E2, BA6566FP, BA6566FP-E2 Selling Leads, Datasheet
MFG:ROHM Package Cooled:06+ D/C:2003
BA6566F-E2, BA6566FP, BA6566FP-E2 Datasheet download

Part Number: BA6566F-E2
MFG: ROHM
Package Cooled: 06+
D/C: 2003
MFG:ROHM Package Cooled:06+ D/C:2003
BA6566F-E2, BA6566FP, BA6566FP-E2 Datasheet download

MFG: ROHM
Package Cooled: 06+
D/C: 2003
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PDF/DataSheet Download
Datasheet: BA604
File Size: 44489 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BA6566FP
File Size: 157835 KB
Manufacturer: ROHM [Rohm]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BA604
File Size: 44489 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
|
Parameter |
Symbol |
Limits |
Unit | |
| Applied voltage |
VL |
16.5 |
V | |
| Power dissipation | BA6566 |
Pd |
1100*1 |
mW |
| BA6566F |
600*2 | |||
| BA6566FP |
1350*3 | |||
| Operating temperature |
Topr |
-35~+60 |
||
| Storage temperature |
Tstg |
-55~+150 |
||
| Current dissipation |
IL |
125*4 |
mA | |
1) Can accommodate both dynamic and piezoelectric receivers, simply by changing the circuit constant for a wide dynamic reception range.
2) Automatic gain control (AGC) is used, based on the transmission and reception telephone line current, for easier compliance with communications standards.
3) Erroneous operation caused by high-frequency electrical wave interference is minimized.
4) An HSOP package is used, eliminating the need for an attached transistor to dissipate heat. This means that a common circuit can be shared when a DIP package is used (BA6566FP).
