BGA27X2LOT6, BGA292, BGA310 Selling Leads, Datasheet
MFG:SAMPO Package Cooled:n/a D/C:00+
BGA27X2LOT6, BGA292, BGA310 Datasheet download

Part Number: BGA27X2LOT6
MFG: SAMPO
Package Cooled: n/a
D/C: 00+
MFG:SAMPO Package Cooled:n/a D/C:00+
BGA27X2LOT6, BGA292, BGA310 Datasheet download

MFG: SAMPO
Package Cooled: n/a
D/C: 00+
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PDF/DataSheet Download
Datasheet: BGA
File Size: 291680 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BGA
File Size: 291680 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BGA310
File Size: 21053 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
| Parameter | Symbol | Value | Unit |
| Device current | ID | 60 | mA |
| Total power dissipation, TS 99 °C | Ptot | 250 | mW |
| RF input power | PRFin | 10 | dBm |
| Junction temperature | Tj | 150 | |
| Ambient temperature | TA | -65 ...+150 | |
| Storage temperature | Tstg | -65 ...+150 | |
| Thermal Resistance | |||
| Junction - soldering point 1) | RthJS | 205 | K/W |
