BGA312, BGA318, BGA348 Selling Leads, Datasheet
MFG:SAMPO Package Cooled:SOT143 D/C:00+
BGA312, BGA318, BGA348 Datasheet download

Part Number: BGA312
MFG: SAMPO
Package Cooled: SOT143
D/C: 00+
MFG:SAMPO Package Cooled:SOT143 D/C:00+
BGA312, BGA318, BGA348 Datasheet download

MFG: SAMPO
Package Cooled: SOT143
D/C: 00+
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
TOP
PDF/DataSheet Download
Datasheet: BGA312
File Size: 20885 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BGA318
File Size: 21000 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BGA
File Size: 291680 KB
Manufacturer:
Download : Click here to Download
| Parameter | Symbol | Value | Unit |
| Device current | ID | 60 | mA |
| Total power dissipation, TS 99 °C | Ptot | 25 | mW |
| RF input power | PRFin | 10 | dBm |
| Junction temperature | Tj | 150 | |
| Ambient temperature | TA | -65 ...+150 | |
| Storage temperature | Tstg | -65 ...+150 | |
| Thermal Resistance | |||
| Junction - soldering point 1) | RthJS | 205 | K/W |
| Parameter | Symbol | Value | Unit |
| Device current | ID | 60 | mA |
| Total power dissipation, TS 99 °C | Ptot | 250 | mW |
| RF input power | PRFin | 5 | dBm |
| Junction temperature | Tj | 150 | |
| Ambient temperature | TA | -65 ...+150 | |
| Storage temperature | Tstg | -65 ...+150 | |
| Thermal Resistance | |||
| Junction - soldering point 1) | RthJS | 205 | K/W |
