BSH101, BSH102, BSH103 Selling Leads, Datasheet
MFG:PHILIPS Package Cooled:SOT-23 D/C:05+
BSH101, BSH102, BSH103 Datasheet download
Part Number: BSH101
MFG: PHILIPS
Package Cooled: SOT-23
D/C: 05+
BSH101, BSH102, BSH103
- Table of contents:
Info of BSH101
Info of BSH102
Info of BSH103
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About BSH101
PDF/DataSheet Download
Datasheet: BSH101
File Size: 658780 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
About BSH102
PDF/DataSheet Download
Datasheet: BSH102
File Size: 99190 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
About BSH103
PDF/DataSheet Download
Datasheet: BSH103
File Size: 98841 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
BSH101 General Description
N-channel enhancement mode MOS transistor in a SOT23 SMD package.
BSH101 Maximum Ratings
|
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
|
VDS |
drain-source voltage (DC) |
60 |
V | ||
|
VGS |
gate-source voltage (DC) |
±20 |
V | ||
|
ID |
drain current (DC) |
Ts = 80 °C; note 1 |
0.7 |
A | |
|
IDM |
peak drain current |
note 2 |
2.8 |
A | |
|
Ptot |
total power dissipation |
Ts = 80 °C |
0.5 |
W | |
|
Tamb = 25 °C; note 3 |
0.75 |
W | |||
|
Tamb = 25 °C; note 4 |
0.54 |
W | |||
|
Tstg |
storage temperature |
-55 |
+150 |
°C | |
|
Tj |
operating junction temperature |
-55 |
+150 |
°C |
1. Ts is the temperature at the soldering point of the drain lead.
2. Pulse width and duty cycle limited by maximum junction temperature.
3. Device mounted on a printed-circuit board with a R th a-tp (ambient to tie-point) of 27.5 K/W.
4. Device mounted on a printed-circuit board with a R th a- tp (ambient to tie-point) of 90 K/W.
BSH101 Features
· Very low threshold
· High-speed switching
· No secondary breakdown
· Direct interface to C-MOS, TTL etc.
· High-speed switching
· No secondary breakdown
· Direct interface to C-MOS, TTL etc.
BSH101 Typical Application
· Power management
· DC to DC converters
· Battery powered applications
· 'Glue-logic'; interface between logic blocks and/or periphery
· General purpose switch.
· DC to DC converters
· Battery powered applications
· 'Glue-logic'; interface between logic blocks and/or periphery
· General purpose switch.
BSH101 Connection Diagram
BSH102 General Description
N-channel enhancement mode MOS transistor in a SOT23 SMD package
BSH102 Maximum Ratings
|
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
|
VDS |
drain-source voltage (DC) |
30 |
V | ||
|
VGS |
gate-source voltage (DC) |
±20 |
V | ||
|
ID |
drain current (DC) |
Ts = 80 °C; note 1 |
0.85 |
A | |
|
IDM |
peak drain current |
note 2 |
3.4 |
A | |
|
Ptot |
total power dissipation |
Ts = 80 °C |
0.5 |
W | |
|
Tamb = 25 °C; note 3 |
0.75 |
W | |||
|
Tamb = 25 °C; note 4 |
0.54 |
W | |||
|
Tstg |
storage temperature |
-55 |
+150 |
°C | |
|
Tj |
operating junction temperature |
-55 |
+150 |
°C |
1. Ts is the temperature at the soldering point of the drain lead.
2. Pulse width and duty cycle limited by maximum junction temperature.
3. Device mounted on a printed-circuit board with a R th a-tp (ambient to tie-point) of 27.5 K/W.
4. Device mounted on a printed-circuit board with a R th a- tp (ambient to tie-point) of 90 K/W.
BSH102 Features
· Very low threshold
· High-speed switching
· No secondary breakdown
· Direct interface to C-MOS, TTL etc.
· High-speed switching
· No secondary breakdown
· Direct interface to C-MOS, TTL etc.
BSH102 Typical Application
` Power management
` DC to DC converters
` Battery powered applications
` 'Glue-logic'; interface between logic blocks and/or periphery
` General purpose switch.
` DC to DC converters
` Battery powered applications
` 'Glue-logic'; interface between logic blocks and/or periphery
` General purpose switch.
BSH102 Connection Diagram
BSH103 General Description
N-channel enhancement mode MOS transistor in a SOT23 SMD package.
BSH103 Maximum Ratings
|
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
|
VDS |
drain-source voltage (DC) |
30 |
V | ||
|
VGS |
gate-source voltage (DC) |
±8 |
V | ||
|
ID |
drain current (DC) |
Ts = 80 °C; note 1 |
0.85 |
A | |
|
IDM |
peak drain current |
note 2 |
3.4 |
A | |
|
Ptot |
total power dissipation |
Ts = 80 °C |
0.5 |
W | |
|
Tamb = 25 °C; note 3 |
0.54 |
W | |||
|
Tamb = 25 °C; note 4 |
0.54 |
W | |||
|
Tstg |
storage temperature |
-55 |
+150 |
°C | |
|
Tj |
operating junction temperature |
-55 |
+150 |
°C |
1. Ts is the temperature at the soldering point of the drain lead.
2. Pulse width and duty cycle limited by maximum junction temperature.
3. Device mounted on a printed-circuit board with a R th a-tp (ambient to tie-point) of 27.5 K/W.
4. Device mounted on a printed-circuit board with a R th a- tp (ambient to tie-point) of 90 K/W.
BSH103 Features
· Very low threshold
· High-speed switching
· No secondary breakdown
· Direct interface to C-MOS, TTL etc.
· High-speed switching
· No secondary breakdown
· Direct interface to C-MOS, TTL etc.
BSH103 Typical Application
` Power management
` DC to DC converters
` Battery powered applications
` 'Glue-logic'; interface between logic blocks and/or periphery
` General purpose switch
` DC to DC converters
` Battery powered applications
` 'Glue-logic'; interface between logic blocks and/or periphery
` General purpose switch
BSH103 Connection Diagram
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