BST16, BST39, BST39.115 Selling Leads, Datasheet
MFG:Philips Package Cooled:SOT-89 D/C:02+
BST16, BST39, BST39.115 Datasheet download
Part Number: BST16
MFG: Philips
Package Cooled: SOT-89
D/C: 02+
MFG:Philips Package Cooled:SOT-89 D/C:02+
BST16, BST39, BST39.115 Datasheet download
MFG: Philips
Package Cooled: SOT-89
D/C: 02+
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PDF/DataSheet Download
Datasheet: BST16
File Size: 13126 KB
Manufacturer: PHILIPS [Philips Semiconductors]
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PDF/DataSheet Download
Datasheet: BST39
File Size: 12763 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BST100
File Size: 69274 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
VCBO | collector-base voltage BST15 BST16 |
open emitter | - - |
-200 -350 |
V V |
VCEO | collector-emitter voltage BST15 BST16 |
open base | - - |
-200 -300 |
V V |
VEBO | emitter-base voltage BST15 BST16 |
open collector | - | -4 -6 |
V V |
IC | collector current (DC) | - | -200 | mA | |
ICM | peak collector current | - | -400 | mA | |
IBM | peak base current | - | -200 | mA | |
Ptot | total power dissipation | Tamb 25 °C; note 1 | - | 1.3 | W |
Tstg | storage temperature | -65 | +150 | ||
Tj | junction temperature | - | 150 | ||
Tamb | operating ambient temperature | -65 | +150 |
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm2.
For other mounting conditions, see "Thermal considerations for SOT89 in the General Part of associated Handbook
Part Number | BST39 |
Product Type | NPN |
VCEO (V) | 350 |
IC (A) | 0.5 |
ICM (A) | 1 |
PD (W) | 1 |
hFE Min | 40 |
hFE Max | - |
@ IC (A) | 0.02 |
VCE (SAT) Max (mV) | 500 |
@ IC (A) | 0.05 |
@ IB (mA) | 4 |
fT Min (MHz) | 70 |
RCE (SAT) (mΩ) | - |