MFG:德洲 Package Cooled:N/A D/C:9+
Info of HSTL162822 | Info of HSTL162822DGGR | Info of HSTL16918
MFG: 德洲
Package Cooled: N/A
D/C: 9+
MFG: 德洲 Package Cooled: N/A D/C: 9+ Qty: 20002 Note: New & original, stock offer
TONGGUANG (H.K.) ELECTRICS CO., LIMITED 
Tel: +86-755-83996795
Adddate: 2010-03-22
MFG: N/A Package Cooled: SMD D/C: 99 Qty: 114
Tel: 86-755-8279-1230
Adddate: 2010-03-22
MFG: TI Package Cooled: TSOP56 D/C: 2007+ Qty: 9985 Note: E-mail to me.
Tel: 00-852-60604995
Adddate: 2010-03-22
MFG: TI Package Cooled: TSSOP64 D/C: 01+ Qty: 1065 Note: new and original stock!
Minshunxin Electronics Co.,LTD. 
Tel: 86-755-82579485
Adddate: 2010-03-22
MFG: TI Package Cooled: TSSOP64 Qty: 84
Tel: 86-755-28536689
Adddate: 2010-03-22
MFG: TI Package Cooled: 01+ D/C: TSSOP64 Qty: 84
Interine Electronics Pan -Asia Co.,Ltd 
Contact: Mr.JonathanDong
Tel: 86-755-83278888
Adddate: 2010-03-22
MFG: GROUP Package Cooled: SOP D/C: 04+ Qty: 890
Tel: 86-755-83205231
Adddate: 2010-03-22
PDF/DataSheet Download
Datasheet: HSTL16918
File Size: 94756 KB
Manufacturer:
Download : Click here to Download
Package Cooled: SMD Qty: 650
TACT (H.K.) Century Co., Limited 
Tel: 0086-0755-83014280
Adddate: 2010-03-22
MFG: TI Package Cooled: TSSOP Qty: 318 Note: our own stock
hk chishing electronics company 
Tel: 86-755-61303995
Adddate: 2010-03-22
MFG: 德洲 Package Cooled: N/A D/C: 9+ Qty: 20002 Note: New & original, stock offer
TONGGUANG (H.K.) ELECTRICS CO., LIMITED 
Tel: +86-755-83996795
Adddate: 2010-03-22
MFG: N/A Package Cooled: SMD D/C: 99 Qty: 650
Tel: 86-755-8279-1230
Adddate: 2010-03-22
MFG: PHILIPS Package Cooled: TSOP48 Qty: 117
B.T.Chips(HONGKONG) Electronics Co.,Ltd 
Tel: 86-0755-29215002 / 26001784
Adddate: 2010-03-22
MFG: SMD Package Cooled: TMS D/C: 99 Qty: 650
Contact: Ms.Sara
Tel: 86-0755-82739485
Adddate: 2010-03-22
Package Cooled: SOP D/C: 3 Qty: 120
ASC (HK) Electronic Co., Limited, 
Tel: 0086-755-27953153
Adddate: 2010-03-22
MFG: IEXAS Package Cooled: TSOP D/C: 99+ Qty: 705
ICWINDOWS ELECTRONICS HK CO.,LIMITED 
Tel: 86-0755-83753525
Adddate: 2010-03-22
PDF/DataSheet Download
Datasheet: HSTL16918
File Size: 94756 KB
Manufacturer:
Download : Click here to Download
MFG: TI Package Cooled: TSSOP64 D/C: 01+ Qty: 1065 Note: new and original stock!
Minshunxin Electronics Co.,LTD. 
Tel: 86-755-82579485
Adddate: 2010-03-22
MFG: TI Package Cooled: TSSOP64 Qty: 84
Tel: 86-755-28536689
Adddate: 2010-03-22
MFG: TI Package Cooled: 01+ D/C: TSSOP64 Qty: 84
Interine Electronics Pan -Asia Co.,Ltd 
Contact: Mr.JonathanDong
Tel: 86-755-83278888
Adddate: 2010-03-22
MFG: GROUP Package Cooled: SOP D/C: 04+ Qty: 890
Tel: 86-755-83205231
Adddate: 2010-03-22
Shenzhen Honour Electronic Trading Company 
Tel: 86-0755-82543374
Adddate: 2010-03-22
MFG: KMP D/C: 04+ Qty: 86 Note: STOCK
Jixin Technology HongKong Development Co.,Ltd 
Tel: 0086-755-8254-4498
Adddate: 2010-03-22
MFG: PPT Package Cooled: 06+ D/C: 500
HONGCHUANGXING ELECTRONICS CO.LTD 
Tel: 86-86-33279575
Adddate: 2010-03-22
PDF/DataSheet Download
Datasheet: HSTL16918
File Size: 94756 KB
Manufacturer:
Download : Click here to Download
The HSTL16918 is a 9-bit to 18-bit D-type latch designed for 3.15 to 3.45 V VCC operation. The D inputs accept HSTL levels and the Q outputs provide LVTTL levels.
The HSTL16918 is particularly suitable for driving an address bus to two banks of memory. Each bank of nine outputs is controlled with its own latch-enable (LE) input.
Each of the nine D inputs is tied to the inputs of two D-type latches that provide true data (Q) at the outputs. While LE is LOW the Q outputs of the corresponding nine latches follow the D inputs. When LE is taken HIGH, the Q outputs are latched at the levels set up at the D inputs.
The HSTL16918 is characterized for operation from 0 to +70 °C.
|
Symbol |
Parameter |
Cinditions |
Rating |
Unit |
|
VCC |
Supply voltage range |
–0.5 to +4.6 |
V | |
|
VI |
Input voltage range 2 | –0.5 to VCC +0.5 | ||
|
VO |
Output voltage range 2 |
–0.5 to VCC +0.5 | ||
|
IIK |
Input clamp current | VI < 0 |
-50 |
mA |
|
IOK |
Output clamp current 3 | VO < 0 or VO > VCC |
±50 |
mA |
|
IO |
Continuous output current | VO = 0 to VCC |
±50 |
mA |
| Continuous current through each VCC or GND |
±100 |
mA | ||
|
θJA |
Package thermal impedance 4 |
89 |
°C/W | |
|
Tstg |
Storage temperature range |
-65 to 150 |
°C |
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. This current flows only when the output is in the high state and VO > VCC.
4. The package thermal impedance is calculated in accordance with JESD 51.
• Inputs meet JEDEC HSTL Std. JESD 8–6, and outputs meet Level III specifications
• ESD classification testing is done to JEDEC Standard JESD22.Protection exceeds 2000 V to HBM per method A114.
• Latch-up testing is done to JEDEC Standard JESD78, which exceeds 100 mA.
• Packaged in 48-pin plastic thin shrink small outline package (TSSOP48)
