HVM131S, HVM131SR, HVM132 Selling Leads, Datasheet
MFG:RENESAS Package Cooled:SOT-23 D/C:09+
HVM131S, HVM131SR, HVM132 Datasheet download
Part Number: HVM131S
MFG: RENESAS
Package Cooled: SOT-23
D/C: 09+
HVM131S, HVM131SR, HVM132
- Table of contents:
Info of HVM131S
Info of HVM131SR
Info of HVM132
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About Hvm131s
PDF/DataSheet Download
Datasheet: Hvm131s
File Size: 31190 KB
Manufacturer: hitachi
Download : Click here to Download
About Hvm131sr
PDF/DataSheet Download
Datasheet: Hvm131sr
File Size: 31225 KB
Manufacturer: hitachi
Download : Click here to Download
About Hvm132
PDF/DataSheet Download
Datasheet: Hvm132
File Size: 38766 KB
Manufacturer: hitachi
Download : Click here to Download
HVM131S Maximum Ratings
|
Item |
Symbol |
Value |
Unit |
| Peak reverse voltage |
VRM |
65 |
V |
| Reverse voltage |
VR |
60 |
V |
| Peak forward current |
I F * |
100 |
mA |
| Non-Repetitive peak forward surge current |
Pd * |
150 |
mW |
| Junction temperature |
Tj |
125 |
|
| Storage temperature |
Tstg |
-55 to +125 |
* Two device total
HVM131S Features
• Low capacitance.(C=0.8pF max)
• Low forward resistance. (rf=1.0½ max)
• MPAK package is suitable for high density surface mounting and high speed assembly.
HVM131SR Maximum Ratings
|
Item |
Symbol |
Value |
Unit |
| Peak reverse voltage |
VRM |
65 |
V |
| Reverse voltage |
VR |
60 |
V |
| Forward current |
I F * |
100 |
mA |
| Power dissipation |
Pd * |
150 |
A |
| Junction temperature |
Tj |
125 |
|
| Storage temperature |
Tstg |
-55 to +125 |
* Two device total
HVM131SR Features
• Low capacitance.(C=0.8pF max)
• Low forward resistance. (rf=1.0½ max)
• MPAK package is suitable for high density surface mounting and high speed assembly.
HVM132 Maximum Ratings
|
Item |
Symbol |
Value |
Unit |
| Peak reverse voltage |
VRM |
65 |
V |
| Reverse voltage |
VR |
60 |
V |
| Forward current |
I F |
100 |
mA |
| Power dissipation |
Pd * |
150 |
A |
| Junction temperature |
Tj |
125 |
|
| Storage temperature |
Tstg |
-55 to +125 |
HVM132 Features
• Low capacitance.(C=0.5pF max)
• Low forward resistance. (rf=2.0½ max)
• MPAK package is suitable for high density surface mounting and high speed assembly.
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