HVM131SR

Features: • Low capacitance.(C=0.8pF max)• Low forward resistance. (rf=1.0½ max)• MPAK package is suitable for high density surface mounting and high speed assembly. Specifications Item Symbol Value Unit Peak reverse voltage VRM 65 V Revers...

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HVM131SR Picture
SeekIC No. : 004367845 Detail

HVM131SR: Features: • Low capacitance.(C=0.8pF max)• Low forward resistance. (rf=1.0½ max)• MPAK package is suitable for high density surface mounting and high speed assembly. Specifi...

floor Price/Ceiling Price

Part Number:
HVM131SR
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/24

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Product Details

Description



Features:

• Low capacitance.(C=0.8pF max)
• Low forward resistance. (rf=1.0½ max)
• MPAK package is suitable for high density surface mounting and high speed assembly.




Specifications

Item
Symbol
Value
Unit
Peak reverse voltage
VRM
65
V
Reverse voltage
VR
60
V
Forward current
I F *
100
mA
Power dissipation
Pd *
150
A
Junction temperature
Tj
125
Storage temperature
Tstg
-55 to +125

* Two device total




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