HVM187S, HVM187STR, HVM187WK Selling Leads, Datasheet
MFG:HITACHI Package Cooled:SOT-23 D/C:07+(ROHS)
HVM187S, HVM187STR, HVM187WK Datasheet download
Part Number: HVM187S
MFG: HITACHI
Package Cooled: SOT-23
D/C: 07+(ROHS)
HVM187S, HVM187STR, HVM187WK
- Table of contents:
Info of HVM187S
Info of HVM187STR
Info of HVM187WK
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About HVM187S
PDF/DataSheet Download
Datasheet: HVM187S
File Size: 29100 KB
Manufacturer: HITACHI [Hitachi Semiconductor]
Download : Click here to Download
About HVM10
PDF/DataSheet Download
Datasheet: HVM10
File Size: 53039 KB
Manufacturer: RECTRON [Rectron Semiconductor]
Download : Click here to Download
About HVM187WK
PDF/DataSheet Download
Datasheet: HVM187WK
File Size: 29087 KB
Manufacturer: HITACHI [Hitachi Semiconductor]
Download : Click here to Download
HVM187S Maximum Ratings
|
Item |
Symbol |
Value |
Unit |
| Reverse voltage |
VR |
60 |
V |
| Forward current |
IF |
50 |
mA |
| Power dissipation |
Pd*1 |
100 |
mW |
| Junction temperature |
Tj |
125 |
|
| Storage temperature |
Tstg |
-55 to +125 |
HVM187S Features
· Low forward resistance. (rf = 5.5 max)
· MPAK package is suitable for high density surface mounting and high speed assembly.
· MPAK package is suitable for high density surface mounting and high speed assembly.
HVM187S Connection Diagram
HVM187WK Maximum Ratings
|
Item |
Symbol |
Value |
Unit |
| Reverse voltage | VR |
60 |
V |
| Forward current |
IF |
50 |
mA |
| Power dissipation |
Pd*1 |
100 |
mW |
| Junction temperature |
Tj |
125 |
|
| Storage temperature |
Tstg |
-55 to +125 |
HVM187WK Features
· Low forward resistance. (rf = 5.5 max)
· MPAK package is suitable for high density surface mounting and high speed assembly.
· MPAK package is suitable for high density surface mounting and high speed assembly.
HVM187WK Connection Diagram
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