HYE18L256160BF-7.5, HYE18M512160BF-7.5, HYE25L128160AC-7.5

The HY[B/E]18M512160BF is a high-speed CMOS, dynamic random-access memory containing 536,870,912 bits. It is internally configured as a quad-bank DRAM.

The HY[B/E]18M512160BF uses a double-data-rate architecture to achieve high-speed operation. The doubledata- rate architecture is essentially a 2n prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O pins. A single READ or WRITE access for the DDR Mobile-RAM consists of a single 2n-bit wide, one clock cycle data transfer at the internal DRAM core and two corresponding n-bit wide, onehalf clock cycle data transfers at the I/O pins.

The HY[B/E]18M512160BF is especially designed for mobile applications. It operates from a 1.8V power supply. Power consumption in self refresh mode is drastically reduced by an On-Chip Temperature Sensor (OCTS); it can further be reduced by using the programmable Partial Array Self Refresh (PASR).

A conventional data-retaining Power-Down (PD) mode is available as well as a non-data-retaining Deep Power- Down (DPD) mode. For further power-savings the clock may be stopped during idle periods.

The HY[B/E]18M512160BF is housed in a 60-ball very thin FBGA package. It is available in Commercial (0 to 70) and Extended (-25 to +85) temperature range.