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ML7050LA, ML7060-01Q, ML7074-002

Table of contents:
Info of ML7050LA
Info of ML7060-01Q
Info of ML7074-002

ML7050LA, ML7060-01Q, ML7074-002 Selling Leads, Datasheet

MFG:OKI Package Cooled:QFP D/C:09+

ML7050LA, ML7060-01Q, ML7074-002 Picture

ML7050LA, ML7060-01Q, ML7074-002 Datasheet download

Five Points

Part Number: ML7050LA

MFG: OKI

Package Cooled: QFP

D/C: 09+

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ML7050LA General Description

The Oki ML7050LA is a highly integrated BluetoothTM radio transceiver designed to operate in the global 2.4 GHz Industrial, Scientific, and Medical (ISM) band. The ML7050LA architecture incorporates vital intermediate frequency (IF) and radio frequency (RF) circuits on a low cost, integration-friendly bulk CMOS process.

Bluetooth technology directly supports short range, wireless voice and data communications with 1 Mbps throughput performance in the public ISM band across many applications, employing rapid frequency hopping (1.6K hops/s) spread spectrum (FHSS) approach. The ML7050LA highly integrated CMOS Bluetooth RF transceiver LSI will establish a 2.4 to 2.5 GHz communication link compliant with Bluetooth Specification Version 1.1 and is packaged in the Oki 48-pin ball grid array (BGA) package requires only 7 mm x 7 mm of the systems critical board space.

Oki's Bluetooth LSI family includes baseband LSI (ML70511LA), System Development Kit (BT-SDK), firmware and software (BTS Pack1/2/3). Together, the RF LSI (ML7050LA) and baseband (ML70511LA) devices form a complete hardware solution optimized for low system cost, small form factor, and reduced power consumption Bluetooth applications.

ML7050LA Maximum Ratings

Parameter	Symbol	Conditions	Rated Value	Unit
Power Supply Voltage	V_DD	T_a = 25°C	0.3 to 4.5	V
Input Voltage	V_I	-	0.3 to V_DD +0.3	V
Allowable power dissipation	P_D	-	0.5	W
Storage temperature	T_STO	-	55 to +150	°C
Input RF Power	-	In-Band	TBD	dBm
Input RF Power	-	Out-of-Band	TBD	dBm

ML7050LA Features

• Circuit design based on the Bluetooth Specification Version 1.1.
• CMOS process technology lowers system cost and simplifies future baseband integration
• Fully integrated CMOS RF LSI: TX/RX switch, power amplifier, LNA, image rejection mixer, VCO, PLL, gm-C IF filter, modulator, and demodulator.
• Low IF circuitry eliminates off-chip SAW filter reducing bill-of-material (BOM)
• Class 2 power operation compliant covering a wide range of applications
• Seamless interface with Oki's ML70511LA Bluetooth baseband controller LSI
• Power supply voltage: 2.7 to 3.3 V
• Package: 48-pin BGA (7 mm x 7 mm x 1.41mm)

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