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• 15A, 60V • rDS(ON) = 0.065W • 2kV ESD Protected • Temperature Compensating PSPICE™ Model • Peak Current vs Pulse Width Curve • UIS Rating Curve • 175oC Operating Temperature • Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
RFD15N06LESM Maximum Ratings
RFD15N06LE, RFD15N06LESM
UNITS
Drain to Source Voltage (Note 1) VDSS
60
V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR
60
V
Continuous Drain Current ID
15
A
Pulsed Drain Current (Note 3) IDM
120
A
Gate to Source Voltage VGS
±20
V
Power Dissipation PD
100
W
Linear Derating Factor
0.48
A
Pulsed Avalanche Rating UIS
Refer to UIS SOA
Operating and Storage Temperature .TJ, TSTG
-55 to 75
o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL
300
o C
Package Body for 10s, See Techbrief 334 . Tpkg
260
o C
RFD15N06LESM Features
• 15A, 60V • rDS(ON) = 0.065W • 2kV ESD Protected • Temperature Compensating PSPICE™ Model • Peak Current vs Pulse Width Curve • UIS Rating Curve • 175oC Operating Temperature • Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
RFD15P05 Parameters
Technical/Catalog Information
RFD15P05
Vendor
Fairchild Semiconductor
Category
Discrete Semiconductor Products
Mounting Type
Through Hole
FET Polarity
P-Channel
Drain to Source Voltage (Vdss)
50V
Current - Continuous Drain (Id) @ 25° C
15A
Rds On (Max) @ Id, Vgs
150 mOhm @ 15A, 10V
Input Capacitance (Ciss) @ Vds
1150pF @ 25V
Power - Max
80W
Packaging
Tube
Gate Charge (Qg) @ Vgs
150nC @ 20V
Package / Case
IPak, TO-251, DPak, VPak (3 straight leads + tab)
FET Feature
Standard
Lead Free Status
Contains Lead
RoHS Status
RoHS Non-Compliant
Other Names
RFD15P05 RFD15P05
RFD15P05 Maximum Ratings
RFD15P05, RFD15P05SM,
UNITS
Drain to Source Voltage (Note 1) VDSS
-50
V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR
-50
V
Continuous Drain Current ID
-15
A
Pulsed Drain Current (Note 3) IDM
120
A
Gate to Source Voltage VGS
±20
V
Power Dissipation PD
80
W
Linear Derating Factor
0.533
A
Pulsed Avalanche Rating UIS
Refer to UIS SOA
Operating and Storage Temperature .TJ, TSTG
-55 to 75
o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL
300
o C
Package Body for 10s, See Techbrief 334 . Tpkg
260
o C
RFD15P05 Features
• 15A, 50V • rDS(ON) = 0.150W • Temperature Compensating PSPICE® Model • Peak Current vs Pulse Width Curve • UIS Rating Curve • Related Literature TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"