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RFF602-12, RFF60P06, RFF70N06

RFF602-12, RFF60P06, RFF70N06 Selling Leads, Datasheet

MFG:N/A  Package Cooled:JAT  D/C:05+

RFF602-12, RFF60P06, RFF70N06 Picture

RFF602-12, RFF60P06, RFF70N06 Datasheet download

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Part Number: RFF602-12

 

MFG: N/A

Package Cooled: JAT

D/C: 05+

 

 

 
 
 
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About RFF60P06

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Datasheet: RFF60P06

File Size: 91008 KB

Manufacturer: INTERSIL [Intersil Corporation]

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About RFF60P06

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Datasheet: RFF60P06

File Size: 91008 KB

Manufacturer: INTERSIL [Intersil Corporation]

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About RFF70N06

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Datasheet: RFF70N06

File Size: 80048 KB

Manufacturer: INTERSIL [Intersil Corporation]

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RFF60P06 General Description

The RFF60P06 P-Channel power MOSFET is manufactured using the MegaFET process. This process, which uses feature sizes approaching those of LSI circuits gives optimum utilization of silicon, resulting in outstanding performance. It was designed for use in applications such as switching regulators, switching converters, motor drivers, and relay drivers. <BR><BR>These transistors can be operated directly from integrated circuits. Reliability screening is available as either commercial or TX/TXV equivalent of MIL-S-19500. Contact Intersil Corporation High-Reliability Marketing group for any desired deviations from the data sheet.

Formerly developmental type TA09835.

RFF60P06 Maximum Ratings

  RFF60P06 UNITS
Drain to Source Voltage (Note 1) VDSS -60 V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR -60 V
Continuous Drain Current ID 50 A
Pulsed Drain Current (Note 3) IDM 120 A
Gate to Source Voltage VGS ±20 V
Power Dissipation PD 125 W
Derate Above 25oC 1.0 A
Pulsed Avalanche Rating UIS Refer to UIS SOA  
Operating and Storage Temperature .TJ, TSTG -55 to 75 o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL 300 o C

RFF60P06 Features

• 25A, 60V
• rDS(ON) = 0.030W
• Temperature Compensating PSPICE® Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• 150oC Operating Temperature
• Reliability Screened

RFF70N06 General Description

The RFF70N06 N-Channel power MOSFET is manufactured using the MegaFET process. This process, which uses feature sizes approaching those of LSI circuits gives optimum utilization of silicon, resulting in outstanding performance. It was designed for use in applications such as switching regulators, switching converters, motor drivers, and relay drivers. These transistors can be operated directly from integrated circuits. <BR><BR>Reliability screening is available as either commercial or TX/TXV equivalent of MIL-S-19500. Contact Intersil Corporation High-Reliability Marketing group for any desired deviations from the data sheet.

Formerly developmental type TA49007.

RFF70N06 Maximum Ratings

  RFF70N06 UNITS
Drain to Source Voltage (Note 1) VDSS 60 V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR 60 V
Continuous Drain Current ID 50 A
Pulsed Drain Current (Note 3) IDM 120 A
Gate to Source Voltage VGS ±20 V
Power Dissipation PD 100 W
Linear Derating Factor 0.80 A
Pulsed Avalanche Rating UIS Refer to UIS SOA  
Operating and Storage Temperature .TJ, TSTG -55 to 75 o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL 300 o C

RFF70N06 Features

• 25A†, 60V
• rDS(ON) = 0.025W
• Temperature Compensating PSPICE™ Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• 150oC Operating Temperature
• Reliability Screened
† Current is limited by the package capability.

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