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RFP12N06RLE, RFP12N08, RFP12N08L

Table of contents:
Info of RFP12N06RLE
Info of RFP12N08
Info of RFP12N08L

RFP12N06RLE, RFP12N08, RFP12N08L Selling Leads, Datasheet

MFG:Intersil Package Cooled:9800 D/C:08+/09+

RFP12N06RLE, RFP12N08, RFP12N08L Picture

RFP12N06RLE, RFP12N08, RFP12N08L Datasheet download

Five Points

Part Number: RFP12N06RLE

MFG: Intersil

Package Cooled: 9800

D/C: 08+/09+

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RFP12N06RLE Maximum Ratings

	RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE	UNITS
Drain to Source Voltage (Note 1) V_DSS	60	V
Drain to Gate Voltage (RGS = 1MW) (Note 1)V_DGR	60	V
Continuous (Figure 2)ID	16	A
Pulsed Drain Current (Note 3)IDM	26	A
Gate to Source Voltage V_GS	-5 to10	V
Power DissipationPD	40	W
Linear Derating Factor	0.32	W/oC
Derate above 25oC	0.20	W/oC
Single Pulse Avalanche Energy RatingEAS	Refer to UIS SOA Curve
Operating and Storage Temperature .TJ, T^STG	-55 to 75	^o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s TL	300	^oC
Package Body for 10s, See Techbrief 334 Tpkg	260	^oC

RFP12N06RLE Features

• 12A, 60V
• rDS(ON) = 0.135W
• Electrostatic Discharge Protected
• UIS Rating Curve (Single Pulse)
• Design Optimized for 5V Gate Drive
• Related Literature- TB334 "Guidelines for Soldering Surface MountComponents to PC Boards"

RFP12N08 Maximum Ratings

	RFM12N08	RFM12N10	RFP18N08	RFP18N10	UNITS
Drain to Source Voltage (Note 1) V_DSS	80	100	80	100	V
Drain to Gate Voltage (RGS = 1MW) (Note 1)V_DGR	80	100	80	100	V
Continuous Drain Current ID	12	12	12	12	A
Pulsed Drain Current (Note 3) I_DM	30	30	30	30	A
Gate to Source Voltage V_GS	±20	±20	±20	±20	V
Maximum Power Dissipation PD	75	75	60	60	W
Continuous (TC= 100oC, VGS = 10V) (Figure 2) ID	0.6	0.6	0.48	0.48	W/oC
Operating and Storage Temperature .TJ, T^STG	-55 to 150	-55 to 150	-55 to 150	-55 to 150	oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL	300	300	300	300	^oC
Package Body for 10s, See Techbrief 334 T_pkg	260	260	260	260	^o C

RFP12N08 Features

• 12A, 80V and 100V
• rDS(ON) = 0.200W
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"

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