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• 12A, 80V and 100V • rDS(ON) = 0.200W • Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
RFP12N10L Parameters
Technical/Catalog Information
RFP12N10L
Vendor
Fairchild Semiconductor
Category
Discrete Semiconductor Products
Mounting Type
Through Hole
FET Polarity
N-Channel
Drain to Source Voltage (Vdss)
100V
Current - Continuous Drain (Id) @ 25° C
12A
Rds On (Max) @ Id, Vgs
200 mOhm @ 12A, 5V
Input Capacitance (Ciss) @ Vds
900pF @ 25V
Power - Max
60W
Packaging
Tube
Gate Charge (Qg) @ Vgs
-
Package / Case
TO-220AB
FET Feature
Logic Level Gate
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
RFP12N10L RFP12N10L
RFP12N18 General Description
These are N-Channel enhancement mode silicon gate power field effect transistors designed for applications such as switching regulators, switching converters, motor drivers, relay drivers and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. These types can be operated directly from integrated circuits.
RFP12N18 Maximum Ratings
RFM12N18
RFM12N20
RFP18N18
RFM12N20
UNITS
Drain to Source Voltage (Note 1) VDSS
180
200
180
200
V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR
180
200
180
200
V
Continuous Drain Current ID
12
12
12
12
A
Pulsed Drain Current (Note 3) IDM
30
30
30
30
A
Gate to Source Voltage VGS
±20
±20
±20
±20
V
Maximum Power Dissipation PD
75
75
60
60
W
Continuous (TC= 100oC, VGS = 10V) (Figure 2) ID
0.8
0.8
0.8
0.8
W/oC
Operating and Storage Temperature .TJ, TSTG
-55 to 150
-55 to 150
-55 to 150
-55 to 150
oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL
300
300
300
300
o C
Package Body for 10s, See Techbrief 334 Tpkg
260
260
260
260
o C
RFP12N18 Features
• 12A, 180V and 200V • rDS(ON) = 0.250W • Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"