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RFP12N20, RFP12P08, RFP12P10

Table of contents:
Info of RFP12N20
Info of RFP12P08
Info of RFP12P10

RFP12N20, RFP12P08, RFP12P10 Selling Leads, Datasheet

MFG:Intersil Package Cooled:9800 D/C:08+/09+

RFP12N20, RFP12P08, RFP12P10 Datasheet download

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Part Number: RFP12N20

MFG: Intersil

Package Cooled: 9800

D/C: 08+/09+

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RFP12N20 General Description

These are N-Channel enhancement mode silicon gate power field effect transistors designed for applications such as switching regulators, switching converters, motor drivers, relay drivers and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. These types can be operated directly from integrated circuits.

RFP12N20 Maximum Ratings

	RFM12N18	RFM12N20	RFP18N18	RFM12N20	UNITS
Drain to Source Voltage (Note 1) V_DSS	180	200	180	200	V
Drain to Gate Voltage (RGS = 1MW) (Note 1)V_DGR	180	200	180	200	V
Continuous Drain Current ID	12	12	12	12	A
Pulsed Drain Current (Note 3) I_DM	30	30	30	30	A
Gate to Source Voltage V_GS	±20	±20	±20	±20	V
Maximum Power Dissipation PD	75	75	60	60	W
Continuous (TC= 100oC, VGS = 10V) (Figure 2) ID	0.8	0.8	0.8	0.8	W/oC
Operating and Storage Temperature .TJ, T^STG	-55 to 150	-55 to 150	-55 to 150	-55 to 150	oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL	300	300	300	300	^oC
Package Body for 10s, See Techbrief 334 T_pkg	260	260	260	260	^o C

RFP12N20 Features

• 12A, 180V and 200V
• rDS(ON) = 0.250W
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"

RFP12P08 Maximum Ratings

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . VDS
Drain to Gate Voltage (RGS = 20KW) (Note 1). . . . . . . . . VDGR
Continuous Drain Current . . . . . . . . . . . . . . . . .
RMS Continuous . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current (Note 3 . . . . . . . . . . . . . . . . IDM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . VGS
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . PD
Linear Derating Factor .. . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . .TL
Package Body for 10s, See Techbrief 334 . . . . . . . . .. . Tpkg

RFP12P08
-80
-80
12
30
±20
75
0.6
-55 to 150
300
260

RFP12P10
-100
-100
12
30
±20
75
0.6
-55 to 150
300
260

UNITS
V
V
A
A
V
W
W/oC
oC
oC
oC

RFP12P08 Features

• 12A, 80V and 100V
• rDS(ON) = 0.300W
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedance
• Majority Carrier Device
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"

RFP12P10 Maximum Ratings

RFP12P08
-80
-80
12
30
±20
75
0.6
-55 to 150
300
260

RFP12P10
-100
-100
12
30
±20
75
0.6
-55 to 150
300
260

UNITS
V
V
A
A
V
W
W/oC
oC
oC
oC

RFP12P10 Features

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