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These are N-Channel enhancement mode silicon gate power field effect transistors designed for applications such as switching regulators, switching converters, motor drivers, relay drivers, and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. These types can be operated directly from integrated circuits.
RFP3N50 Maximum Ratings
RFM3N45
RFM3N50
RFP3N45
RFP3N50
UNITS
Drain to Source Voltage (Note 1) VDSS
450
200
500
500
V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR
450
200
500
500
V
Continuous Drain Current ID
3
3
3
3
A
Pulsed Drain Current (Note 3) IDM
30
30
30
30
A
Gate to Source Voltage VGS
±20
±20
±20
±20
V
Maximum Power Dissipation PD
75
75
60
60
W
Continuous (TC= 100oC, VGS = 10V) (Figure 2) ID
0.8
0.8
0.8
0.8
W/oC
Operating and Storage Temperature .TJ, TSTG
-55 to 150
-55 to 150
-55 to 150
-55 to 150
oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL
300
300
300
300
o C
Package Body for 10s, See Techbrief 334 Tpkg
260
260
260
260
o C
RFP3N50 Features
• 3A, 450V and 500V • rDS(ON) = 3W • Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
RFP40N10 Parameters
Technical/Catalog Information
RFP40N10
Vendor
Fairchild Semiconductor
Category
Discrete Semiconductor Products
Mounting Type
Through Hole
FET Polarity
N-Channel
Drain to Source Voltage (Vdss)
100V
Current - Continuous Drain (Id) @ 25° C
40A
Rds On (Max) @ Id, Vgs
40 mOhm @ 40A, 10V
Input Capacitance (Ciss) @ Vds
-
Power - Max
160W
Packaging
Tube
Gate Charge (Qg) @ Vgs
300nC @ 20V
Package / Case
TO-220AB
FET Feature
Standard
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
RFP40N10 RFP40N10
RFP40N10 General Description
These are N-Channel power MOSFETs manufactured using the MegaFET process. This process, which uses feature sizes approaching those of LSI integrated circuits gives optimum utilization of silicon, resulting in outstanding perormance. They were designed for use in applications such as switching regulators, switching converters, motor drivers, relay drivers and emitter switches for bipolar transistors. These transistors can be operated directly from integrated circuits.
Formerly developmental type TA9846
RFP40N10 Maximum Ratings
UNITS
Drain to Source Breakdown Voltage (Note 1)
VDSS
100
V
Drain to Gate Voltage (RGS = 20kW) (Note 1) .
VDGR
100
V
Gate to Source Voltage
VGS
±20
V
Drain Current Continuous (Figure 2).
ID
40
A
Pulsed Drain Current (Note 2)
IDM
100
A
Pulse Avalanche Rating
EAS
Figures 4, 12, 13
Power Dissipation
PD
160
W
Derate Above 25
1.07
W/
Operating and Storage Temperature
TJ, TSTG
-55 to 175
Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s Package Body for 10s, See Techbrief 334
T L Tpkg
300 260
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
RFP40N10 Features
• 40A, 100V • rDS(ON) = 0.040 • UIS Rating Curve • SOA is Power Dissipation Limited • 175 Operating Temperature • Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"