RLP03N06CLE, RLP1N06CLE, RLR05C1000FS Selling Leads, Datasheet
MFG:Intersil Package Cooled:7850 D/C:02+
RLP03N06CLE, RLP1N06CLE, RLR05C1000FS Datasheet download
Part Number: RLP03N06CLE
MFG: Intersil
Package Cooled: 7850
D/C: 02+
RLP03N06CLE, RLP1N06CLE, RLR05C1000FS
- Table of contents:
Info of RLP03N06CLE
Info of RLP1N06CLE
Info of RLR05C1000FS
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About RLP03N06CLE
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Datasheet: RLP03N06CLE
File Size: 95686 KB
Manufacturer: INTERSIL [Intersil Corporation]
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About RLP1N06CLE
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Datasheet: RLP1N06CLE
File Size: 48634 KB
Manufacturer: INTERSIL [Intersil Corporation]
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About RLR32Cxxxx
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Datasheet: RLR32Cxxxx
File Size: 242927 KB
Manufacturer:
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RLP03N06CLE General Description
Temperature Dependence of Current Limiting and
Switching Speed Performance
The RLD03N06CLE, CLESM and RLP03N06CLE are monolithic power devices which incorporate a Logic Level power MOSFET transistor with a current sensing scheme and control circuitry to enable the device to self limit the drain source current flow. The current sensing scheme supplies current to a resistor that is connected across the base to emitter of a bipolar transistor in the control section. The collector of this bipolar transistor is connected to the gate of the power MOSFET transistor. When the ratiometric current from the current sensing reaches the value required to forward bias the base emitter junction of this bipolar transistor, the bipolar "turns on". A resistor is incorporated in series with the gate of the power MOSFET transistor allowing the bipolar transistor to adjust the drive on the gate of the power MOSFET transistor to a voltage which then maintains a constant current in the power MOSFET transistor. Since both the
ratiometric current sensing scheme and the base emitter unction voltage of the bipolar transistor vary with temperature, the current at which the device limits is a function of temperature. This dependence is shown in Figure 3.
The resistor in series with the gate of the power MOSFET transistor also results in much slower switching performance than in standard power MOSFET transistors. This is an advantage where fast switching can cause EMI or RFI. The switching speed is very predictable.
RLP03N06CLE Maximum Ratings
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDSS 60 V
Drain to Gate Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR 60 V
Gate to Source Voltage (Reverse Voltage Gate Bias Not Allowed) . . . . . . . . . . . .VGS +5.5 V
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID Self Limited
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD 30 W
Derate Above 25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.2 W /
Electrostatic Discharge Rating MIL-STD-883, Category B(2) . . . . . . . . . . . . . . . .ESD 2 KV
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG -55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 300
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg 260
RLP03N06CLE Features
• 0.30A, 60V
• rDS(ON) = 6.0W
• Built in Current Limit ILIMIT 0.140 to 0.210A at 150
• Built in Voltage Clamp
• Temperature Compensating PSPICE® Model
• 2kV ESD Protected
• Controlled Switching Limits EMI and RFI
• Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
RLP1N06CLE Maximum Ratings
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDSS 55 V
Drain to Gate Voltage (RGS = 20kW, Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR 55 V
Electrostatic Voltage at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD 2 kV
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID Self Limited
Gate to Source Voltage (Reverse Voltage Gate Bias Not Allowed) . . . . . . . . . . . . . . . . . . . .VGS 5.5 V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PD 36 W
Power Dissipation Derating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.24 W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, TSTG -55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 300
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg 260
Drain to Gate Voltage (RGS = 20kW, Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR 55 V
Electrostatic Voltage at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD 2 kV
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID Self Limited
Gate to Source Voltage (Reverse Voltage Gate Bias Not Allowed) . . . . . . . . . . . . . . . . . . . .VGS 5.5 V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PD 36 W
Power Dissipation Derating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.24 W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, TSTG -55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 300
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg 260
RLP1N06CLE Features
• 1A, 55V
• rDS(ON) = 0.750W
• ILIMIT at 150oC = 1.1A to 1.5A Maximum
• Built-in Voltage Clamp
• Built-in Current Limiting
• ESD Protected, 2kV Minimum
• Controlled Switching Limits EMI and RFI
• 175 Rated Junction Temperature
• Logic Level Gate
• Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
• rDS(ON) = 0.750W
• ILIMIT at 150oC = 1.1A to 1.5A Maximum
• Built-in Voltage Clamp
• Built-in Current Limiting
• ESD Protected, 2kV Minimum
• Controlled Switching Limits EMI and RFI
• 175 Rated Junction Temperature
• Logic Level Gate
• Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
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