STP5NB80, STP5NB80FP, STP5NB90 Selling Leads, Datasheet
MFG:ST Package Cooled:TO-220 D/C:2003
STP5NB80, STP5NB80FP, STP5NB90 Datasheet download

Part Number: STP5NB80
MFG: ST
Package Cooled: TO-220
D/C: 2003
MFG:ST Package Cooled:TO-220 D/C:2003
STP5NB80, STP5NB80FP, STP5NB90 Datasheet download

MFG: ST
Package Cooled: TO-220
D/C: 2003
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PDF/DataSheet Download
Datasheet: STP5NB80
File Size: 110282 KB
Manufacturer: STMICROELECTRONICS [STMicroelectronics]
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PDF/DataSheet Download
Datasheet: STP5NB80FP
File Size: 110282 KB
Manufacturer: STMICROELECTRONICS [STMicroelectronics]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: STP5NB90
File Size: 51226 KB
Manufacturer: STMICROELECTRONICS [STMicroelectronics]
Download : Click here to Download
Using the latest high voltage MESH OVERLAY] process, STMicroelectronics has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending strip layout coupled with the Company's proprietary edge termination structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteristics.
|
Symbol |
Parameter |
Value |
Units |
|
VDSS |
Drain-Source Voltage |
800 |
V |
|
VDGR |
Drain- gate Voltage (RGS = 20 k) |
800 |
V |
|
VGS |
Gate-source Voltage |
±30 |
V |
|
ID |
Drain Current (continuous) at Tc = 25 |
5 |
A |
|
ID |
Drain Current (continuous) at Tc = 100 |
3.2 |
A |
|
IDM(•) |
Drain Current (pulsed) |
20 |
A |
|
Ptot |
Total Dissipation at Tc = 25 |
110 |
W |
| Derat ing Factor |
0.88 |
W/ | |
|
dv/dt (1) |
Peak Diode Recovery voltage slope |
4 |
V/ns |
|
VISO |
Insulat ion Withstand Voltage (DC) |
- |
V |
|
Tstg |
Storage Temperature |
-65 to +150 |
|
|
Tj |
Max. Operating Junction Temperature |
150 |
|
TYPE |
VDSS |
RDS(on) |
ID |
| STP5NB80 |
800 V |
< 2.2 |
5 A |
Using the latest high voltage MESH OVERLAY] process, STMicroelectronics has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending strip layout coupled with the Company's proprietary edge termination structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteristics.
|
Symbol |
Parameter |
Value |
Units |
|
VDSS |
Drain-Source Voltage |
800 |
V |
|
VDGR |
Drain- gate Voltage (RGS = 20 k) |
800 |
V |
|
VGS |
Gate-source Voltage |
±30 |
V |
|
ID |
Drain Current (continuous) at Tc = 25 |
5(*) |
A |
|
ID |
Drain Current (continuous) at Tc = 100 |
3.2 |
A |
|
IDM(•) |
Drain Current (pulsed) |
20 |
A |
|
Ptot |
Total Dissipation at Tc = 25 |
40 |
W |
| Derat ing Factor |
0.32 |
W/ | |
|
dv/dt (1) |
Peak Diode Recovery voltage slope |
4 |
V/ns |
|
VISO |
Insulat ion Withstand Voltage (DC) |
2000 |
V |
|
Tstg |
Storage Temperature |
-65 to +150 |
|
|
Tj |
Max. Operating Junction Temperature |
150 |
|
TYPE |
VDSS |
RDS(on) |
ID |
| STP5NB80FP |
800 V |
< 2.2 |
5 A |
Using the latest high voltage MESH OVERLAY]process, STMicroelectronics has designed anadvanced family of power MOSFETs with outstanding performances. The new patentpending strip layout coupled with the Company'sproprietary edge termination structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteristics.
| Symbol | Parameter | Value | Unit | |
| STP5NB90 | STP5NB90FP | |||
| VDS | Drain-source Voltage (VGS = 0) | 900 | V | |
| VDGR | Drain- gate Voltage (RGS = 20 kW) | 900 | V | |
| VGS | Gate-source Voltage | ± 30 | V | |
| ID | Drain Current (continuous) at Tc = 25 oC | 5 | 5(*) | A |
| ID | Drain Current (continuous) at Tc = 100 oC | 3.1 | 3.1(*) | A |
| IDM(•) | Drain Current (pulsed) | 20 | 20 | A |
| Ptot | Total Dissipation at Tc = 25 oC | 125 | 40 | W |
| Derating Factor | 1.0 | 0.32 | W/oC | |
| dv/dt (1) | Peak Diode Recovery voltage slope | 4.5 | 4.5 | V/ns |
| VISO | Insulat ion Withstand Voltage (DC) ' | - | 2000 | V |
| Ts tg | Storage Temperature | -65 to 150 | oC | |
| Tj Max | . Operating Junction Temperature | 150 | oC | |
(•) Pulse width limited by safe operating area
( 1) ISD 35 A di/dt 3 200 A/ms, VDD 3 V(BR)DSS, Tj 3 TJMAX
(*) Limited only by maximum temperature allowed
