XCB170, XCB170X, XCB195A3208 Selling Leads, Datasheet
MFG:DIP-6 Package Cooled:1 D/C:99+
XCB170, XCB170X, XCB195A3208 Datasheet download
Part Number: XCB170
MFG: DIP-6
Package Cooled: 1
D/C: 99+
MFG:DIP-6 Package Cooled:1 D/C:99+
XCB170, XCB170X, XCB195A3208 Datasheet download
MFG: DIP-6
Package Cooled: 1
D/C: 99+
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PDF/DataSheet Download
Datasheet: XCB170
File Size: 275913 KB
Manufacturer: CLARE [Clare, Inc.]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: XCB170
File Size: 275913 KB
Manufacturer: CLARE [Clare, Inc.]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: XCB170
File Size: 275913 KB
Manufacturer: CLARE [Clare, Inc.]
Download : Click here to Download
The XCB170 is a 1-Form-B relay which uses optically coupled MOSFET technology to provide 3750V of input to output isolation. The efficient MOSFET switches and photovoltaic die use Clare's patented OptoMOS® architecture. A highly efficient GaAIAs infrared LED controls the optically coupled input. The device is available in small 6-pin dual in line package in standard through hole and surface mount lead bend.
Parameter | Min | Typ | Max | Units |
Input Power Dissipation | - | - | 1501 | mW |
Input Control Current Peak (10ms) |
- - |
- | 50 1 |
mA A |
Reverse Input Voltage | - | - | 5 | V |
Total Power Dissipation | - | - | 8002 | mW |
Isolation Voltage Input to Output |
3750 | - | - | VRMS |
Operational Temperature | -40 | - | +85 | |
Storage Temperature | -40 | - | +125 | |
Soldering Temperature DIP Package Surface Mount Package (10 Seconds Max.) |
- - |
- | +260 +220 |