Winbond Announced New SpiFlash Serial Flash Memories with Smallest Package

Published:2011/11/23 20:12:00 Author:Phyllis From:SeekIC

Winbond, a pioneer and leader in Serial Flash memories, announced a family of new SpiFlash Serial Flash memories which offers the industry’s smallest packages per density. With minimal package dimensions, the devices meet the space-saving needs of the rapidly growing mobile-computing market with a range of densities from 512K-bit to 16M-bit.

Winbond’s SpiFlash memory growth has been significant since it first introduced the popular multi-I/O Serial Flash architecture, from 20 million units in 2006 to more than one billion in the first three quarters of 2011.

Winbond’s 90-nanometer Flash technology is manufactured at the company’s 12-inch wafer fabrication facility in Taichung Taiwan and has been key in not only driving Flash memory growth to 40 percent of Winbond’s revenue, but also instrumental in achieving small die sizes for extremely space-efficient packaging. The company’s new 58nm technology will continue this trend as it rolls out over the next several quarters.

The new devices will be applied to applications include space-critical designs, such as smart phones, Bluetooth headsets, cameras, digital video, gaming, GPS, wireless modules and other mobile/handheld products.

As new mobile and handheld products are designed smaller yet more technologically advanced, they require higher-capacity memories but in reduced sizes. Serial Flash memory provides a viable solution, as it delivers a variety of capacities with minimal real estate requirement.

The new USON and WLBGA devices round out Winbond’s broad portfolio of SpiFlash memories in standard packages such as SOIC, WSON and FBGA. Small-form-factors, low-pin-count and low-power, over a broad range of Serial Flash densities, make these new devices well-suited for mobile and handheld applications that are increasingly challenged for available board space.

The new SpiFlash memories come in densities of 512Kb, 1Mb, 2Mb, 4Mb and 8Mb in 2.5V or 3V versions; power-saving 1.8V versions are also available for 2Mb and 4Mb densities. The 8Mb USON is the industry’s highest density available in such a package. The WLBGA devices are available in 8Mb (3.4mm2) and 16Mb (4.8mm2) densities that operate at 1.8V. The WLBGAs are 0.47mm in height and use 11 percent and 16 percent the space, respectively, of a WSON or SOIC package. The WLBGA packages also provide design security by preventing access to the chips’ signals once mounted to PCBs.

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan. Winbond’s major products include specialty DRAM, mobile RAM, NOR Flash and graphics DRAM with revenues in 2010 of approximately one billion US dollars. Winbond has around 1,800 employees worldwide, with offices in Taiwan, Hong Kong, Japan, and the USA.

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