The Market for Semiconductor Packaging Materials will hit $25.7 Billion by 2015

Published:2011/12/27 1:56:00 Author:Phyllis From:SeekIC

SEMI is a global industry association that serves the nano- and microelectronics manufacturing supply chains. Its member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges since 1970.

TechSearch International is a technology licensing and consulting company specializing in accurate, relevant and timely information on advanced packaging technology and market developments that founded in 1987.

Recently, the two companies together published a report in which claims that the market for semiconductor packaging materials, including thermal interface materials, is expected to reach $22.8 billion in 2011 and grow to $25.7 billion by 2015.

The largest segment of the market is the laminate substrates which worth an estimated $9.7 billion globally in 2011. It is projected to grow at a compound annual growth rate of 8% over the next five years.

The report covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics and thermal interface materials.

Several areas are experiencing stronger growth as new material ramp up in production in packaging, including underfill materials, wafer-level dielectrics, copper bonding, leadframe CSP, and others.

The findings in the report are based on more than 140 indepth interviews conducted with packaging subcontractors, semiconductor manufacturers and materials suppliers. It includes previously unpublished data on revenue, unit shipments and market shares for each packaging material segment; a five-year forecast of revenue and units (2011-2015), average selling price data and trends; and an analysis of regional market trends.

The report also identifies important technology and business trends affecting the packaging materials market, as well as opportunities for suppliers.

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