Sony plans to spend $1-billion on stacked CMOS sensor

Published:2012/6/25 2:06:00 Author:Ecco From:SeekIC

According to Sony Corp., it has planed to spend about 80 billion yen (about $1 billion) by September 2013 in expanding its manufacturing capacity for stacked CMOS image sensors.

Sony Semiconductor has already assigned 45 billion yen investment on Nagasaki wafer fab, and the investment will be finished on March 31, 2013. The company will increase Sony’s production capacity for image sensors to 60,000 wafers per month.

Sony announced that, stacked CMOS image sensors attach the back-illuminated sensors on to ICs that perform signal processing, rather than using substrates to support both the back-illuminated CMOS image sensors and processing IC. The sensors have smaller size which allows more compact size for digital cameras and mobile devices.

However, Sony wishes that the billion-dollar cost can solidify Sony’s position as the largest maker of CMOS image sensors and address the rapidly increasing demand for image sensors for use in smartphones and tablet computers.

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