UMC has licensed IBM technology to implement 20-nm FinFETs

Published:2012/7/2 3:02:00 Author:Ecco From:SeekIC

Taiwanese chip foundry United Microelectronics Corp. (UMC) said that it has licensed technology from IBM Corp. to expedite the development of its 20-nm CMOS process, including FinFET 3-D transistors. The agreement indicates that IBM will license its 20-nm process design kit and FinFET technology to UMC so the foundry can accelerate the availability of these processes for UMC customers.

UMC's engineers has developed 20-nm planar process which will be aligned to IBM's design rules and process/device targets, while UMC’s FinFET will be offered as a low-power technology enhancement option for mobile computing and communication products. As the result of the license deal, UMC is not joining the Common Process Platform—the IBM-led process technology alliance that includes Globalfoundries Inc. and Samsung Electronics Co. Ltd. The agreement will only cover 20-nm and FinFET technologies.

FinFETs are three-dimensional, fin-based multi-gate transistors. Intel Corp. is currently available to support 22-nm devices featuring FinFETs—known by Intel as tri-gate transistors. Taiwan Semiconductor Manufacturing Co. Ltd., UMC’s biggest rival in the foundry business, is not planning to implement FinFETs until the 14-nm node. Globalfoundries and Samsung are also planning to implement FinFETs at the 14-nm node.

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