11-21/GHC-YT1U2/2T

Standard LED - SMD Brilliant Green Water Clear

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11-21/GHC-YT1U2/2T Picture
SeekIC No. : 0051425 Detail

11-21/GHC-YT1U2/2T: Standard LED - SMD Brilliant Green Water Clear

floor Price/Ceiling Price

US $ .12~.16 / Piece | Get Latest Price
Part Number:
11-21/GHC-YT1U2/2T
Mfg:
Everlight
Supply Ability:
5000

Price Break

  • Qty
  • 0~1850
  • 1850~2000
  • 2000~5000
  • 5000~10000
  • Unit Price
  • $.16
  • $.14
  • $.13
  • $.12
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/4/28

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Product Details

Quick Details

LED Size : 1206 Illumination Color : Green
Wavelength/Color Temperature : 520 nm to 535 nm Lens Color/Style : Water Clear
Luminous Intensity : 500 mcd Viewing Angle : 60 deg
Packaging : Reel    

Description

Forward Current :
Forward Voltage :
Illumination Color : Green
Lens Color/Style : Water Clear
Packaging : Reel
Viewing Angle : 60 deg
Luminous Intensity : 500 mcd
LED Size : 1206
Wavelength/Color Temperature : 520 nm to 535 nm


Features:

`Package in 8mm tape on 7diameter reel.
`Compatible with automatic placement equipment.
`Compatible with infrared and vapor phase reflow solder process.
`Mono-color type.
`Pb-free.
`The product itself will remain within RoHS complaint version.



Application

·Automotive: backlighting in dashboard and switch.
·Telecommunication: indicator and backlighting in telephone and fax.
·Flat backlight for LCD, switch and symbol.
·General use.



Specifications

Parameter Symbol Rating Units
Continuous Forward Current IF 25 mA
Peak Forward Current(Duty 1/10 @ 1KHZ) IFP 100 mA
Reverse Voltage VR 5 V
Operating Temperature Topr -40 ~ +85
Storage Temperature Tstg -40 ~ +90
Soldering Temperature Tsol Reflow Soldering : 260 for 10 sec.
Hand Soldering : 350 for 3 sec.
Power Dissipation Pd 110 mW
Electrostatic Discharge ESD 150 V



Description

The 11-21/GHC-YT1U2/2T features:

·The 11-21 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
·Besides, lightweight makes them ideal for miniature applications. etc.




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