·The 19-218 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
·Besides, lightweight makes them ideal for miniature applications. etc.
|
Parameter |
Symbol |
Rating |
Unit |
|
Reverse Voltage Forward Current Operating Temperature Storage Temperature Soldering Temperature Electrostatic Discharge Power Dissipation Peak Forward Current (Duty 1/10 @1KHz) |
VR IF Topr Tstg Tsol ESD Pd IF |
5 25 -40 ~ +85 -40 ~ +90 260 (for 5 seconds) 150 110 100 |
V mA ℃ ℃ ℃ V mW mA |
·Package in 8mm tape on 7〞diameter reel.
·Compatible with automatic placement equipment.
·Compatible with infrared and vapor phase reflow solder process.
·Mono-color type.
·Pb-free.
·The product itself will remain within RoHS compliant version.