BGA HEAT SINK
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| Technical/Catalog Information | 374324B60023G |
| Vendor | Aavid Thermalloy |
| Category | Thermal Management |
| Attachment Method | Solder Anchor |
| Height | 0.39" (9.9mm) |
| Material | - |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | 1.5W @ 50°C |
| Thermal Resistance @ Forced Air Flow | 6°C/W @ 500 LFM |
| Outline | 27.00mm x 27.00mm |
| Thermal Resistance @ Natural | 30.6°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 374324B60023G 374324B60023G |