HEATSINK BGA W/O SOLDER ANCHORS
374724B60024G: HEATSINK BGA W/O SOLDER ANCHORS
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| Technical/Catalog Information | 374724B60024G |
| Vendor | Aavid Thermalloy |
| Category | Thermal Management |
| Attachment Method | Solder Anchor |
| Height | 0.709" (18mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | 3W @ 50°C |
| Thermal Resistance @ Forced Air Flow | 5.2°C/W @ 200 LFM |
| Outline | 35.00mm x 35.00mm |
| Thermal Resistance @ Natural | 15.3°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 374724B60024G 374724B60024G HS326 ND HS326ND HS326 |