387MS8

Features: SpecificationsDescription The 387MS8 has the following features including +32 dBm Input IP3;Conversion Loss: 9.5 dB;Low External Part Count;Ultra Small MSOP8 Package: 14.8 mm2;Included in the HMC-DK003 Designer's Kit. The HMC387MS8 are high dynamic range passive MMIC mixers in plastic su...

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SeekIC No. : 004229419 Detail

387MS8: Features: SpecificationsDescription The 387MS8 has the following features including +32 dBm Input IP3;Conversion Loss: 9.5 dB;Low External Part Count;Ultra Small MSOP8 Package: 14.8 mm2;Included in ...

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Part Number:
387MS8
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:






Specifications






Description

      The 387MS8 has the following features including +32 dBm Input IP3;Conversion Loss: 9.5 dB;Low External Part Count;Ultra Small MSOP8 Package: 14.8 mm2;Included in the HMC-DK003 Designer's Kit.
      The HMC387MS8 are high dynamic range passive MMIC mixers in plastic surface mount 8 lead Mini Small Outline Packages (MSOP) covering 450 to 500 MHz. Excellent input IP3 performance of +32 dBm for down conversion and +29 dBm for up conversion is provided for both GSM/CDMA based cellular and Private Land Mobile Radio applications at an LO drive of +17dBm. The mixer also has excellent performance with as little as +13 dBm LO drive yielding a +30 dBm input IP3. With a 1 dB compression of +22 dBm, the RF port will accept a wide range of input signal levels. Conversion loss is 9.5 dB typical. The DC to 150 MHz IF frequency response will satisfy many cellular transmit or receive frequency plans. The HMC387MS8 input IP3 performance coupled with its high P1dB rivals traditional active FET mixers while offering a much smaller 14.8mm2 standard IC footprint and no DC bias.receive operations. Therefore, the X76F102 will be considered a slave in all applications.
      The circuit board used in the fi nal application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown. A suffi cient number of VIA holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request.For applications not requiring operation to DC this port should be DC blocked externally using a series capacitor.
      At present there is not too much information about this model.If you are willing to find more  about 387MS8 , please pay attention to our web! We will promptly update the relevant information.






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