HEATSINK CPU 25MM SQ H=.45" BLK
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| Capacitance : | 16.5 pF | Series: | 625 |
| Manufacturer: | Wakefield Thermal Solutions | Type: | Top Mount |
| Package Cooled: | BGA | Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins | Length: | 0.984" (24.99mm) |
| Width: | 0.984" (24.99mm) | Diameter: | - |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) | Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 8.0°C/W @ 400 LFM | Thermal Resistance @ Natural: | - |
| Material: | Aluminum |