6412

Input Voltage
                                                                     -26V to +0.3V
Power Dissipation
(Note 2, 3)
                                                                     Internally Limited
Operating Temperature Range (Tj)
                                                                     -55 C to +125 C
Maximum Junction Temperature (Tjmax)
                                                                     150 C
Storage Temperature Range
                                                                     -65 C to +150 C
Thermal Resistance
ThetaJA
   16-Pin CERAMIC DIP (Still Air @ 0.5 C/W)   75 C/W
                      (500LF/Min Air flow                  35 C/W
                       @ 0.5 C/W)                    
ThetaJC
    16-Pin CERAMIC DIP                                   5 C/W
(Note 3)
Lead Temperature
  (Soldering, 10 seconds)                               260 C
ESD Susceptibility
(Note 4)
                                                                      2kV
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.

Note 2: The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax -TA)/ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower. If this dissipation is exceeded, the die temperature will rise above 125 C, and the LM2990 will eventually go into thermal shutdown at a Tj of approximately 160 C.  

Note 3: The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using junction-to-ambient, rather than junction-to-case, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out of the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. The stated junction-to-case thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. 

Note 4: Human body model, 100pF discharged through a 1.5K Ohms resistor.

The 6412 is low dropout, 1 ampere negative voltage regulator available with fixed output voltages of -5, -12, and -15V.

The 6412 uses new circuit design techniques to provide low dropout and low quiescent current. The dropout voltage at 1A load current is typically 0.6V and a guaranteed worst-case maximum of 1V over the entire operating temperature range. The quiescent current is typically 1mA with 1A load current and an input-output voltage differential greater than 3V. A unique circuit design of the internal bias supply limits the quiescent current to only 9mA (typical) when the regulator is in the dropout mode (Vout - Vin < 3V).Output voltage accuracy is guaranteed to +5% over load, and temperature extremes.

The 6412 is short-circuit proof, and thermal shutdown includes hysteresis to enhance the reliability of the device when overloaded for an extended period of time.