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Part Number: 74AC11074
Description: This device contains two independent positive-edge-triggered D-type flip-flops. A low level at the preset (


Description: This device contains two independent positive-edge-triggered D-type flip-flops. A low level at the preset (
This device contains two independent positive-edge-triggered D-type flip-flops. A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input that meets the setup-time requirements are transferred to the outputs on the low-to-high transition of the clock (CLK) pulse.
Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input may be changed without affecting the levels at the outputs. The 74AC11074 is characterized for operation from 40°C to 85°C.
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . 0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . .0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . .±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±100 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): D package . .1.25 W
N package . . . . . . . . . . . . . . . . . . . 1.1 W
PW package . . . . . . . . . . . . . . . . . 0.5 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are bserved.
2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils, except for the N package, which has a trace length of zero.
· Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise
· EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process
· 500-mA Typical Latch-Up Immunity at 125°C
· Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (N)
74AC11074
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