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Part Number: 74AC16823

 

 

 

 

Description: These 18-bit flip-flops feature 3-state outputs designe...


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74AC16823 General Description


These 18-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing wider buffer registers, I/O ports, parity bus interfacing, and working registers.

The 'AC16823 can be used as two 9-bit flip-flops or one 18-bit flip-flop. With the clock-enable (CLKEN) input low, the D-type flip-flops enter data on the low-to-high transitions of the clock. Taking CLKEN high disables the clock buffer, thus latching the outputs. Taking the clear (CLR) input low causes the Q outputs to go low independently of the clock.

The output enable (OE) input can be used to place the outputs in either a normal logic state (high or low) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.

OE does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The 74AC16823 is packaged in TI's shrink small-outline package (DL), which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16374 is characterized for operation over the full military temperature range of 55°C to 125°C. The 74AC16823 is characterized for operation from 40°C to 85°C.

74AC16823 Maximum Ratings

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . .0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . .±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . .±50 mA
Continuous current through VCC or GND  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... ±450mA
Maximum power package dissipation at TA = 55°C (in still air)(see Note 2): DL package . .. . . 1.4 W
Storage temperature range ,Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . .65°C to 150°C 
 

74AC16823 Features

 Members of the Texas Instruments Widebus TM Family
 Provides Extra Data Width Necessary for Wider Address/Data Paths or Buses With Parity
 Flow-Through Architecture Optimizes PCB Layout
 Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
 EPIC TM (Enhanced-Performance Implanted CMOS) 1-m Process
 500-mA Typical Latch-Up Immunity at 125°C
 Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Package Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Pin Spacings

74AC16823 Connection Diagram

74AC16823  Connection Diagram

74AC16823 datasheet

74AC16823
PDF/DataSheet Download

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