HEATSINK STAMP 22.9X8X10.2MM
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| Capacitance : | 18.18 pF | Series: | - |
| Manufacturer: | Comair Rotron | Type: | Top Mount |
| Package Cooled: | TO-252 (DPak) | Attachment Method: | SMD Pad |
| Shape: | Rectangular | Length: | 0.315" (8mm) |
| Width: | 0.90" (22.86mm) | Diameter: | - |
| Height Off Base (Height of Fin): | 0.400" (10.16mm) | Power Dissipation @ Temperature Rise: | 2.5W @ 35°C |
| Thermal Resistance @ Forced Air Flow: | 17.5°C/W @ 300 LFM | Thermal Resistance @ Natural: | - |
| Material: | Copper |
| Technical/Catalog Information | 834100T00000 |
| Vendor | Comair-Rotron |
| Category | Thermal Management |
| Attachment Method | SMD Pad |
| Height | 0.4" (10.16mm) |
| Material | Copper |
| Package Cooled | D²Pak |
| Power Dissipation @ Temperature Rise | 2.5W @ 35°C |
| Thermal Resistance @ Forced Air Flow | 17.5°C/W @ 300 LFM |
| Outline | 22.86mm x 8mm |
| Thermal Resistance @ Natural | - |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 834100T00000 834100T00000 CR496 ND CR496ND CR496 |