Features: ·Compatible with automatic placement equipment.·Compatible with infrared and vapor phase reflow solder process.·Eia std. package.·IC compatible.·Pb- free.·The product itself will remain within RoHS compliant version.Application·Automotive: backlighting in dashboard and switch.·Telecommun...
93-21SUBC/S400-XX/TR8: Features: ·Compatible with automatic placement equipment.·Compatible with infrared and vapor phase reflow solder process.·Eia std. package.·IC compatible.·Pb- free.·The product itself will remain wi...
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·Compatible with automatic placement equipment.
·Compatible with infrared and vapor phase reflow solder process.
·Eia std. package.
·IC compatible.
·Pb- free.
·The product itself will remain within RoHS compliant version.
Parameter |
Symbol |
Rating |
Unit |
Reverse Voltage |
VR |
5 |
V |
Forward Current |
IF |
25 |
mA |
Peak Forward Current (Duty 1/10 @1KHz) |
IFP |
100 |
|
Power Dissipation |
Pd |
110 |
mW |
Electrostatic Discharge(HBM) |
ESD |
150 |
V |
Operating Temperature |
Topr |
-40 ~ +85 |
|
Storage Temperature |
Tstg |
-40 ~ +100 |
|
Soldering Temperature |
Tsol |
Reflow Soldering : 260 for 10 sec. |