Features: ·Compatible with automatic placement equipment.·Compatible with infrared and vapor phase reflow solder process.·Eia std. package.·IC compatible.·Pb-free.·The product itself will remain within RoHS compliant version.Application·Automotive: backlighting in dashboard and switch.·Telecommuni...
93-21SUGC: Features: ·Compatible with automatic placement equipment.·Compatible with infrared and vapor phase reflow solder process.·Eia std. package.·IC compatible.·Pb-free.·The product itself will remain wit...
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Features: ·Compatible with automatic placement equipment.·Compatible with infrared and vapor phase...
Parameter | Symbol | Rating | Unit |
Reverse Voltage | VR | 5 | V |
Forward Current | IF | 25 | mA |
Operating Temperature | Topr | -40 ~ +85 | |
Storage Temperature | Tstg | -40 ~ +100 | |
Electrostatic Discharge(HBM) | ESD | 2000 | V |
Power Dissipation | Pd | 110 | mW |
Peak Forward Current (Duty 1/10 @ 1KHZ) |
IFP | 100 | mA |
Soldering Temperature | Tsol | Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. |