Features: ·Compatible with automatic placement equipment.·Compatible with infrared and vapor phase reflow solder process.·Eia std. package.·IC compatible.·Pb-freeApplication·Automotive: backlighting in dashboard and switch.·Telecommunication: indicator and backlighting in telephone and fax.·Indica...
93-21UBC: Features: ·Compatible with automatic placement equipment.·Compatible with infrared and vapor phase reflow solder process.·Eia std. package.·IC compatible.·Pb-freeApplication·Automotive: backlighting...
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Features: ·Compatible with automatic placement equipment.·Compatible with infrared and vapor phase...
| Parameter | Symbol | Rating | Unit |
| Reverse Voltage | VR | 5 | V |
| Forward Current | IF | 30 | mA |
| Operating Temperature | Topr | -40 ~ +85 | |
| Storage Temperature | Tstg | -40 ~ +100 | |
| Soldering Temperature | Tsol | 260(for 5second) | |
| Electrostatic Discharge | ESD | 2000 | V |
| Power Dissipation | Pd | 140 | mW |
| Peak Forward Current(Duty 1/10 @1KHZ) | IFP | 70 | mA |