960063A

Features: • 100Base-TX, 10/100Base-TX, ATM155 or 100 Mbps TP-FDDI applications• Compatible with multiple transceivers• Low profile, surface mount or through-hole packaging available• Available with or without impedance matched common mode termination• 2000 Vrms isolat...

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960063A Picture
SeekIC No. : 004259295 Detail

960063A: Features: • 100Base-TX, 10/100Base-TX, ATM155 or 100 Mbps TP-FDDI applications• Compatible with multiple transceivers• Low profile, surface mount or through-hole packaging availabl...

floor Price/Ceiling Price

Part Number:
960063A
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

• 100Base-TX, 10/100Base-TX, ATM155 or 100 Mbps TP-FDDI applications
• Compatible with multiple transceivers
• Low profile, surface mount or through-hole packaging available
• Available with or without impedance matched common mode termination
• 2000 Vrms isolation
• 350H OCL (inductance) @ 8mA bias



Application

• These Bel part types have been designed for use in 100 Mbps TP-FDDI, 100Base-TX, 10/100Base-TX and ATM 155 Mbps applications over Category 5 UTP or STP cable. Each part type provides high voltage isolation, wave shaping, superior EMI and noise suppression and fast rise times. All parts meet IEEE 802.3, ANSI X3T9.5 and ATM Forum Committee standards.
• Each Bel part type is designed with high voltage isolation transformers and common mode chokes. The S558-5999- 43 and -44 also contain an impedance matched common mode termination. For background information on the proper implementation or complete elimination of this termination consult Bel's separate application note available on this subject. All designs have been created to provide 350H OCL (inductance) with 8mA DC bias applied. Consult the Bel short form catalog and recommended application circuit for the specific configuration of each individual part type.
• Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped on tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility  ith high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability. Each  art is optically inspected to meet rigid coplanarity requirements.




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