AD7441

(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . .. . . . . . . -0.3 V to +7 V
VIN+ to GND . . . . . . . . . . . . .. 0.3 V to VDD + 0.3 V
VIN- to GND . . . . . . . . . . . . . .. 0.3 V to VDD + 0.3 V
Digital Input Voltage to GND . . . . . . . . -0.3 V to +7 V
Digital Output Voltage to GND . -0.3 V to VDD + 0.3 V
VREF to GND . . . . . . . . . . . . . .. . -0.3 V to VDD +0.3 V
Input Current to Any Pin Except Supplies2 .. . ±10mA
Operating Temperature Range
Commercial (A, B Version) . . . . . . . . . -40oC to +85oC
Storage Temperature Range . . . . . . -65oC to +150oC
Junction Temperature . . . . . . . . . . . . . . . . . . +150oC

JA Thermal Impedance . . . . . . . 205.9°C/W (µSOIC)
211.5°C/W (SOT-23)

JC Thermal Impedance . . . . . . 43.74°C/W (µSOIC)
91.99°C/W (SOT-23)
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . +215oC
Infared (15 secs) . . . . . . . . . . . . . . . . . . . . . +220oC
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5kV
NOTES
1Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Transient currents of up to 100 mA will not cause SCR latch up.

The AD7451/AD7441 are respectively 12- and 10-bit, high speed, low power, successive-approximation (SAR) analog-to-digital converters that feature a pseudo differential analog input. These parts operate from a single 2.7 V to 5.25 V power supply and feature throughput rates up to 1MSPS. The parts contains a low-noise, wide bandwidth, differential track and hold amplifier (T/H) which can handle input frequencies in excess of 1MHz with the -3dB point being 20MHz typically.

The reference voltage is 2.5 V and is applied externally to the VREF pin. The conversion process and data acquisition are controlled using CS and the serial clock allowing the device to interface with Microprocessors or DSPs.

The input signals are sampled on the falling edge of CS and the conversion is also initiated at this point.

The SAR architecture of these parts ensures that there are no pipeline delays. MICROWIRE is a trademark of National Semiconductor Corporation. SPI and QSPI are trademarks of Motorola, Inc.