AD7854

(TA = +25°C unless otherwise noted)
AVDD to AGND  . . . . . . . . . . . . . . . . . . . . . . .  0.3 V to +7 V
DVDD to DGND  . . . . . . . . . . . . . . . . . . . . . . .  0.3 V to +7 V
AV  to DV  . . . . . . . . . . . . . . . . . . . . . . .  . .  0.3 V to +0.3 V
Analog Input Voltage to AGND  . . . .  0.3 V to AVDD + 0.3 V
Digital Input Voltage to DGND  . . . .  0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND  . . .  0.3 V to DVDD + 0.3 V
REFIN/REFOUT to AGND  . . . . . . . . .  0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except Supplies^{2. . . . . . . . . ±10 mA
Operating Temperature Range
Commercial (A, B Versions)  . . . . . . . . . . .  40°C to +85°C
Commercial (S Version) . . . . . . . . . . . . . .  55°C to +125°C
Storage Temperature Range . . . . . . . . . . .  65°C to +150°C
Junction Temperature  . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Cerdip Package, Power Dissipation  . . . . . . . . . . . . . .  450 mW
_{JA Thermal Impedance  . . . . . . . . . . . . . . . . . . . . . . 75°C/W}
Lead Temperature, (Soldering, 10 secs)  . . . . . . . . . +300°C
SOIC, SSOP Package, Power Dissipation  . . . . . . . . .  450 mW
JA Thermal Impedance . . .  75°C/W (SOIC) 115°C/W (SSOP)
JC Thermal Impedance . . .  25°C/W (SOIC)  35°C/W (SSOP)
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 secs)  . . . . . . . . . . . . . . . . . . . . . . . . . +220°C}