AD7908

AVDD to AGND...........................................................  0.3 V to +7 V
VDRIVE to AGND........................................... 0.3 V to AVDD + 0.3 V
Analog Input Voltage to AGND..................... 0.3 V to AVDD + 0.3 V
Digital Input Voltage to AGND................................... 0.3 V to +7 V
Digital Output Voltage to AGND....................0.3 V to AVDD + 0.3 V
REFIN to AGND............................................ 0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except Supplies2......................... ±10 mA
Operating Temperature Range
Commercial (B Version)...................................... 40°C to +85°C
Storage Temperature Range............................65°C to +150°C
Junction Temperature.......................................................... 150°C
TSSOP Package, Power Dissipation.....................................450 mW
qJA Thermal Impedance......................................143°C/W (TSSOP)
qJC Thermal Impedance....................................... 45°C/W (TSSOP)
Lead Temperature, Soldering
Vapor Phase (60 sec)...........................................................215°C
Infrared (15 sec).................................................................. 220°C
ESD........................................................................................... 2 kV
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2 Transient currents of up to 100 mA will not cause SCR latch-up.