AD8380JS

The AD8380JS is one member of the AD8380 series.The AD8380 provides a fast, 10-bit latched decimating digital input that drives 6-channel high voltage drive outputs. The 10-bit input word is sequentially muxed into six separate high speed,bipolar DACs. Flexible digital input formats allow several AD8380s to be used in parallel for higher resolution displays.

Features of the AD8380JS are:(1)high-voltage drive to within 1.3 V of supply rails; (2)24 V supply for fast output voltage drivers; (3)high update rates: fast 75 Ms/s 10-bit input word rate; (4)low power dissipation, 550 mW with power-down; (5)voltage controlled video reference and full-scale(contrast) output levels; (6)INV bit reverses polarity of video signal; (7)nominal 3.3 V logic and 15 V analog supplies; (8)flexible logic:addressable or sequential channel loading,STSQ/CS allow parallel ad8380 operation for XGA and greater resolution; (9)drives capacitive loads; (10)26 ns settling time to 1% up to 150 pF load; (11)slew rate 270 V/s; (12)available in 44-Lead MQFP.

The absolute maximum ratings of the AD8380JS can be summarized as:(1)supply voltage AVCCAVEE:26 V;(2)storage temperature range:-65 to +125;(3)operating temperature range:0 to 85;(4)lead temperature range (soldering 10 sec):300°C.Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum ratings for extended periods may effect device reliability.The maximum power that can be safely dissipated by the AD8380 is limited by the associated rise in junction temperature.The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Exceeding this limit temporarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure.