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MFG:ADI D/C:09
Part Number: ADG412
MFG: ADI
D/C: 09
Description: The ADG411, ADG412 and ADG413 are monolithic CMOS devices comprising four independently selectable switches. They are d...
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ADG412
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DataSheet
General Description
ADG412 General Description
The ADG411, ADG412 and ADG413 are monolithic CMOS devices comprising four independently selectable switches. They are designed on an enhanced LC2
MOS process which provides low power dissipation yet gives high switching speed and low on resistance. The on resistance profile is very flat over the full analog input range ensuring excellent linearity and low distortion when switching audio signals. Fast switching speed coupled with high signal bandwidth also make the parts suitable for video signal switching. CMOS construction ensures ultralow power dissipation making the parts ideally suited for portable and battery powered instruments.
The ADG411, ADG412 and ADG413 contain four independent SPST switches. The ADG411 and ADG412 differ only in that the digital control logic is inverted. The ADG411 switches are turned on with a logic low on the appropriate control input, while a logic high is required for the ADG412. The ADG413 has two switches with digital control logic similar to that of the ADG411 while the logic is inverted on the other two switches. Each switch conducts equally well in both directions when ON and each has an input signal range that extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make switching action for use in multiplexer applications. Inherent in the design is low charge injection for minimum transients when switching the digital inputs.
ADG412 Maximum Ratings
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +25 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to 25 V
VL to GND . . . . . . . . . . . . . . . . . . . . . . 0.3 V to VDD + 0.3 V
Analog, Digital Inputs2. . . . . . . . . . . VSS 2 V to VDD +2 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . 40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . 55°C to +125°C
Storage Temperature Range . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . .. . . . . +150°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . 900 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300°C
Plastic Package, Power Dissipation . . . . . . . . . . . . . 470 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 117°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . 600 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 77°C/W
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 115°C/W
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 35°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +25 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to 25 V
VL to GND . . . . . . . . . . . . . . . . . . . . . . 0.3 V to VDD + 0.3 V
Analog, Digital Inputs2. . . . . . . . . . . VSS 2 V to VDD +2 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . 40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . 55°C to +125°C
Storage Temperature Range . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . .. . . . . +150°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . 900 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300°C
Plastic Package, Power Dissipation . . . . . . . . . . . . . 470 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 117°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . 600 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 77°C/W
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 115°C/W
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 35°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
ADG412 Features
44 V Supply Maximum Ratings
615 V Analog Signal Range
Low On Resistance (<35 V)
Fast Switching Times
tON <175 ns
tOFF <145 ns
TTL/CMOS Compatible
Plug-In Replacement for DG411/DG412/DG413
615 V Analog Signal Range
Low On Resistance (<35 V)
Fast Switching Times
tON <175 ns
tOFF <145 ns
TTL/CMOS Compatible
Plug-In Replacement for DG411/DG412/DG413
ADG412 Typical Application
Audio and Video Switching
Automatic Test Equipment
Precision Data Acquisition
Battery Powered Systems
Sample Hold Systems
Communication Systems
Automatic Test Equipment
Precision Data Acquisition
Battery Powered Systems
Sample Hold Systems
Communication Systems
ADG412 Connection Diagram
ADG412
PDF/DataSheet Download
- Datasheet: ADG412
- File Size: 160499 KB
- Manufacturer: AD [Analog Devices]
- Click here to Download
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