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MFG:ADI D/C:09
Part Number: ADG444
MFG: ADI
D/C: 09
Description: The ADG441, ADG442 and ADG444 are monolithic CMOS devices comprising four independently selectable switches. They are d...
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ADG444
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DataSheet
General Description
ADG444 General Description
The ADG441, ADG442 and ADG444 are monolithic CMOS devices comprising four independently selectable switches. They are designed on an enhanced LC2
MOS process that provides low power dissipation yet gives high switching speed and low on resistance. The on resistance profile is very flat over the full analog input range ensuring good linearity and low distortion when switching audio signals. High switching speed also makes the parts suitable for video signal switching. CMOS construction ensures ultralow power dissipation making the parts ideally suited for portable and battery powered instruments.
The ADG441, ADG442 and ADG444 contain four independent SPST switches. Each switch of the ADG441 and ADG444 turns on when a logic low is applied to the appropriate control input. The ADG442 switches are turned on with a logic high on the appropriate control input. The ADG441 and ADG444 switches differ in that the ADG444 requires a 5 V logic power supply which is applied to the VL pin. The ADG441 and ADG442 do not have a VL pin, the logic power supply being generated internally by an on-chip voltage generator.
ADG444 Maximum Ratings
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +25 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to 25 V
VL to GND . . . . . . . . . . . . . . . . . . . . . . 0.3 V to VDD + 0.3 V
Analog, Digital Inputs2. . . . . . . . . . . . VSS 2 V to VDD + 2 V
or 30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . .40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . .55°C to +125°C
Storage Temperature Range . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . 900 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . +300°C
Plastic Package, Power Dissipation . . . . . . . . . . . . 470 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 177°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . .. . +260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . .. 600 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . .. . . +220°C
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +25 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to 25 V
VL to GND . . . . . . . . . . . . . . . . . . . . . . 0.3 V to VDD + 0.3 V
Analog, Digital Inputs2. . . . . . . . . . . . VSS 2 V to VDD + 2 V
or 30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . .40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . .55°C to +125°C
Storage Temperature Range . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . 900 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . +300°C
Plastic Package, Power Dissipation . . . . . . . . . . . . 470 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 177°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . .. . +260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . .. 600 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . .. . . +220°C
ADG444 Features
44 V Supply Maximum Ratings
VSS to VDD Analog Signal Range
Low On Resistance (< 70 Ω)
Low ∆RON (9 Ω max)
Low RON Match (3 Ω max)
Low Power Dissipation
Fast Switching Times
tON < 110 ns
tOFF < 60 ns
Low Leakage Currents ( 3 nA max)
Low Charge Injection (6 pC max)
Break-Before-Make Switching Action
Latch-Up Proof
Plug-In Upgrade for DG201A/ADG201A, DG202A/ADG202A, DG211/ADG211A
Plug in Replacement for DG441/DG442/DG444
VSS to VDD Analog Signal Range
Low On Resistance (< 70 Ω)
Low ∆RON (9 Ω max)
Low RON Match (3 Ω max)
Low Power Dissipation
Fast Switching Times
tON < 110 ns
tOFF < 60 ns
Low Leakage Currents ( 3 nA max)
Low Charge Injection (6 pC max)
Break-Before-Make Switching Action
Latch-Up Proof
Plug-In Upgrade for DG201A/ADG201A, DG202A/ADG202A, DG211/ADG211A
Plug in Replacement for DG441/DG442/DG444
ADG444 Typical Application
Audio and Video Switching
Automatic Test Equipment
Precision Data Acquisition
Battery Powered Systems
Sample Hold Systems
Communication Systems
Automatic Test Equipment
Precision Data Acquisition
Battery Powered Systems
Sample Hold Systems
Communication Systems
ADG444 Connection Diagram
ADG444
PDF/DataSheet Download
- Datasheet: ADG444
- File Size: 331523 KB
- Manufacturer: AD [Analog Devices]
- Click here to Download
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