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MFG:ADI D/C:09
Part Number: ADG781
MFG: ADI
D/C: 09
Description: The ADG781, ADG782, and ADG783 are monolithic CMOS devices containing four independently selectable sw...
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ADG781
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DataSheet
General Description
ADG781 General Description
The ADG781, ADG782, and ADG783 are monolithic CMOS devices containing four independently selectable switches. These switches are designed on an advanced submicron process that provides low power dissipation and high switching speed, low on resistance, low leakage currents and high bandwidth.
They are designed to operate from a single 1.8 V to 5.5 V supply,making them ideal for use in battery powered instruments and with the new generation of DACs and ADCs from Analog Devices. Fast switching times and high bandwidth make the part suitable for video signal switching.
The ADG781, ADG782, and ADG783 contain four independent single-pole/single throw (SPST) switches. The ADG781 and ADG782 differ only in that the digital control logic is inverted.The ADG781 switches are turned on with a logic low on the appropriate control input, while a logic high is required to turn on the switches of the ADG782. The ADG783 contains two switches whose digital control logic is similar to the ADG781,while the logic is inverted on the other two switches.
Each switch conducts equally well in both directions when ON.The ADG783 exhibits break-before-make switching action.
The ADG781/ADG782/ADG783 are available in 20-lead chip scale packages.
ADG781 Maximum Ratings
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +6 V
Analog, Digital Inputs2 . . . . . . . . . . 0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . 40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Chip Scale Package
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 32°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . . 300°C
IR Reflow (<20 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 235°C
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.
ADG781 Features
`1.8 V to 5.5 V Single Supply
`Low On Resistance (2.5 Typ)
`Low On-Resistance Flatness (0.5 )
`3 dB Bandwidth > 200 MHz
`Rail-to-Rail Operation
`20-Lead 4 mm * 4 mm Chip Scale Package
`Fast Switching Times
tON = 16 ns
tOFF = 10 ns
`Typical Power Consumption (< 0.01 W)
`TTL/CMOS Compatible
`For Functionally Equivalent Devices in 16-Lead TSSOP and SOIC Packages, See ADG711/ADG712/ADG713
`Low On Resistance (2.5 Typ)
`Low On-Resistance Flatness (0.5 )
`3 dB Bandwidth > 200 MHz
`Rail-to-Rail Operation
`20-Lead 4 mm * 4 mm Chip Scale Package
`Fast Switching Times
tON = 16 ns
tOFF = 10 ns
`Typical Power Consumption (< 0.01 W)
`TTL/CMOS Compatible
`For Functionally Equivalent Devices in 16-Lead TSSOP and SOIC Packages, See ADG711/ADG712/ADG713
ADG781 Typical Application
·Battery Powered Systems
·Communication Systems
·Sample Hold Systems
·Audio Signal Routing
·Video Switching
·Mechanical Reed Relay Replacement
·Communication Systems
·Sample Hold Systems
·Audio Signal Routing
·Video Switching
·Mechanical Reed Relay Replacement
ADG781 Connection Diagram
ADG781
PDF/DataSheet Download
- Datasheet: ADG781
- File Size: 434176 KB
- Manufacturer: AD
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